Glass substrate and laminate using same

Patent metadata

Field	Value
Publication number	US-10669184-B2
Application number	US-201615552539-A
Country	US
Kind code	B2
Filing date	Jan 22, 2016
Priority date	Feb 23, 2015
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.

First claim

The invention claimed is:

1. A glass substrate, which has a total thickness variation of less than 2.0 μm and comprises an information identification part formed of a plurality of dots,
wherein the dots are formed by cracks extending from an inside of the glass substrate to a surface layer thereof.

2. The glass substrate according to claim 1 , wherein the dots are formed by thermal shock through laser irradiation.

3. The glass substrate according to claim 1 , wherein the dots adjacent to each other have a distance between centers of 100 μm or less.

4. The glass substrate according to claim 1 , wherein the dots each have a diameter of from 0.5 μm to 10 μm.

5. The glass substrate according to claim 1 , wherein the information identification part has input therein one kind or two or more kinds of information selected from a manufacturing company name of the glass substrate, a material of the glass substrate, a thermal expansion coefficient of the glass substrate, an outer diameter of the glass substrate, a thickness of the glass substrate, the total thickness variation of the glass substrate, a manufacturing date of the glass substrate, a delivery date of the glass substrate, and a serial number of the glass substrate.

6. The glass substrate according to claim 1 , wherein the glass substrate has a warpage level of 60 μm or less.

7. The glass substrate according to claim 1 , wherein all or part of a surface of the glass substrate comprises a polished surface.

8. The glass substrate according to claim 1 , wherein the glass substrate further comprises a formed joined surface in an inside of glass.

9. The glass substrate according to claim 1 , wherein the glass substrate has a contour of a wafer shape.

10. The glass substrate according to claim 1 , wherein the glass substrate is used for supporting a substrate to be processed in a manufacturing process for a semiconductor package.

11. A laminate, comprising at least a substrate to be processed and a glass substrate configured to support the substrate to be processed, the glass substrate comprising the glass substrate of claim 1 .

12. The laminate according to claim 11 , wherein the substrate to be processed comprises at least a semiconductor chip molded with a sealing material.

13. A method of manufacturing a glass substrate, the method comprising the steps of:
(1) cutting a mother glass sheet to provide a glass substrate;
(2) polishing a surface of the glass substrate so that the glass substrate has a total thickness variation of less than 2.0 μm; and
(3) forming cracks extending from an inside of the glass substrate to a surface layer thereof by thermal shock through laser irradiation to form an information identification part formed of a plurality of dots.

Assignees

• Nippon Electric Glass Co

Inventors

• Katayama Hiroki

Classifications

• C03C23/001

  by infrared light · CPC title

• C03C23/0025 Primary

  by a laser beam · CPC title

• C03B17/064 Primary

  by the overflow downdraw fusion process; Isopipes therefor · CPC title

• H01L21/561

  Electricity · mapped topic

• B23K2103/56

  being semiconducting · CPC title