Bonding structure on gold thin film

Patent metadata

Field	Value
Publication number	US-10668696-B2
Application number	US-201615388070-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	Jul 1, 2014
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

First claim

The invention claimed is:

1. A structure comprising:
a first member; and
a second member,
the first member being made of a material other than gold and having a surface on which a gold thin film is formed,
the second member being made of a material other than gold,
the first member containing a specific region, the surface of the first member being exposed by removing the gold thin film via laser irradiation with laser light in at least a part of the specific region,
the second member being bonded to the specific region by use of an adhesive,
wherein:
the specific region is contained in a region to which the second member is bonded on the surface of the first member and the specific region has an outer circumference having no angular corner; and
a sum total of an area of a region in which the gold thin film remains in the specific region is greater than 0% but not more than 60% of an area of the specific region.

2. The structure as set forth in claim 1 , wherein the specific region is an annular region which extends along an outer circumference of a region to which the second member is bonded on the surface of the first member.

3. The structure as set forth in any one of claim 1 , wherein the second member is a transparent member.

4. A structure comprising:
a first member; and
a second member,
the first member being made of a material other than gold and having a surface on which a gold thin film is formed,
the second member being made of a material other than gold,
the first member containing a specific region, the surface of the first member being exposed by removing the gold thin film via laser irradiation with laser light in at least a part of the specific region,
the second member being bonded to the specific region by use of an adhesive,
wherein the specific region is an annular region which extends along an outer circumference of a region to which the second member is bonded on the surface of the first member, and
a sum total of an area of a region in which the gold thin film remains in the specific region is greater than 0% but not more than 60% of an area of the specific region.

5. The structure as set forth in claim 4 , wherein the second member is a transparent member.

Assignees

• Fujikura Ltd

Inventors

• Kumeta Shohei
• Yoshino Gento
• Kasai Yohei
• Sakamoto Akira

Classifications

• C09J2205/31

  Chemistry & Metallurgy · mapped topic

• H01L2224/83874

  Electricity · mapped topic

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2250/44

  Number of layers variable across the laminate · CPC title

• B32B2250/02

  2 layers · CPC title