Apparatus and method for a high performance carbon fiber laminate enclosure part for an information handling system

US10668674B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10668674-B2
Application numberUS-201615158310-A
CountryUS
Kind codeB2
Filing dateMay 18, 2016
Priority dateMay 18, 2016
Publication dateJun 2, 2020
Grant dateJun 2, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An enclosure part for an information handling system is disclosed that may include materials formed together into a rectangular shape. The enclosure part may have a void on a core side and a flatness equal to or less than 0.5 mm. The materials may include a sheet of carbon fiber, a piece of non-woven carbon fiber, and a non-woven glass fiber. A method for manufacturing an enclosure part using through-plane temperature control may include inserting into a mold a sheet of carbon fiber and a piece of non-woven carbon fiber, heat pressing the sheet of carbon fiber with the piece of non-woven carbon fiber, and cooling a first portion of the mold including the sheet of carbon fiber and the piece of non-woven carbon fiber more quickly than a second portion of the mold including the sheet of carbon fiber, and removing the enclosure part from the mold.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing an enclosure part for an information handling system, the method comprising: inserting a sheet of carbon fiber into a mold; inserting a piece of non-woven carbon fiber into the mold; heat pressing the sheet of carbon fiber with the piece of non-woven carbon fiber while using through-plane temperature control in the mold to control temperature orthogonal to a plane formed by the sheet of carbon fiber; cooling, while using the through-plane temperature control, a first portion of the mold including the sheet of carbon fiber and the piece of non-woven carbon fiber more quickly than a second portion of the mold including the sheet of carbon fiber, wherein the cooling forms a molded part; removing the molded part from the mold after the cooling of the first portion of the mold and the second portion of the mold; and forming the enclosure part from the molded part, wherein the forming comprises machining a lip on a core side of the molded part using an undercut. 2. The method of claim 1 , wherein the sheet of carbon fiber is machined before being inserted into the mold; and the piece of non-woven carbon fiber is machined by at least one of: die cutting and water let cutting before being inserted into the mold. 3. The method of claim 1 , further comprising pre-heating the sheet of carbon fiber and the piece of non-woven carbon fiber before said heat pressing of the sheet of carbon fiber with the piece of non-woven carbon fiber, wherein the step of heat pressing further includes heating the first portion of the mold more quickly than the second portion of the mold. 4. The method of claim 1 , further comprising inserting a protective film into the mold, wherein the step of heat pressing transfers a surface finish from the protective film to a cavity side of the molded part. 5. The method of claim 1 , wherein the forming of the enclosure part further comprises trimming the molded part after said removing of the molded part from the mold. 6. The method of claim 1 , wherein the forming of the enclosure part further comprises painting the molded part. 7. The method of claim 1 , further comprising inserting a carbon fiber hinge into the mold between the sheet of carbon fiber and the piece of non-woven carbon fiber. 8. The method of claim 1 , further comprising inserting a non-woven glass fiber into the mold to form a region of the molded part to permit wireless signals to pass, the region formed by said heat pressing and said cooling. 9. The method of claim 1 , wherein the forming the enclosure part further comprises: measuring a flatness of the molded part; determining that the flatness of the molded part is not acceptable based on a comparison between the measured flatness of the molded part and a flatness threshold; heating the molded part having the unacceptable flatness; and stamping the molded part having the unacceptable flatness to improve the flatness of the molded part. 10. The method of claim 9 , wherein the flatness threshold is 0.5 mm. 11. The method of claim 1 , wherein the piece of non-woven carbon fiber is pre-impregnated with a first thermoplastic and the sheet of carbon fiber includes continuous fibers and a second thermoplastic. 12. The method of claim 11 , wherein the first thermoplastic and the second thermoplastic are made from a common polymer, wherein the common polymer is polycarbonate.

Assignees

Inventors

Classifications

  • Carbon · CPC title

  • Sheets, plates, blanks or films · CPC title

  • for making multilayered articles · CPC title

  • Heating or curing, e.g. crosslinking or vulcanizing {during moulding, e.g. in a mould}(cold vulcanisation B29C35/18 {; vulcanising tyres, presses therefor B29D30/0601}) · CPC title

  • Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process (controlling or regulating chemical, physical or physico- chemical processes in general B01J19/0006) · CPC title

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What does patent US10668674B2 cover?
An enclosure part for an information handling system is disclosed that may include materials formed together into a rectangular shape. The enclosure part may have a void on a core side and a flatness equal to or less than 0.5 mm. The materials may include a sheet of carbon fiber, a piece of non-woven carbon fiber, and a non-woven glass fiber. A method for manufacturing an enclosure part using t…
Who is the assignee on this patent?
Dell Products Lp
What technology area does this patent fall under?
Primary CPC classification B29C70/545. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).