Component mounter with a push function

US10667451B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10667451-B2
Application numberUS-201815893371-A
CountryUS
Kind codeB2
Filing dateFeb 9, 2018
Priority dateFeb 9, 2018
Publication dateMay 26, 2020
Grant dateMay 26, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section, a first end of the protruding portion attached to the base section at a tool attaching position, and a second end of the protruding portion positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. The component mounter uses the component handing tools to simultaneously push a component at two push locations so as to insert the component onto the board.

First claim

Opening claim text (preview).

The invention claimed is: 1. A component mounter comprising: a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units, each mounting unit including a tool rotation device, and a component handling tool, the component handling tool including a base section and a protruding portion extending in a downward direction from the base section, the protruding portion including a first end attached to the base section at a tool attaching position and a second end positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. 2. The component mounter according to claim 1 , wherein: the protruding portion includes an intermediate portion forming substantially right angles with the first end and the second end, respectively, such that the second end of the protruding portion still extends downwards. 3. The component mounter according to claim 1 , wherein: the component handling tool is a suction nozzle. 4. The component mounter according to claim 2 , wherein: the protruding portion forms a nozzle section attachment that fits onto the component handling tool. 5. The component mounter according to claim 1 , wherein: the component handling tool is a clamp. 6. The component mounter according to claim 5 , further including: an end insertable in the component. 7. The component mounter according to claim 1 , further comprising: data management circuitry configured to determine a tool offset amount commensurate with a distance from the tool attaching position to a position of the second end of the protruding portion and component push location data commensurate with two push locations at which the component should be pushed; processing circuitry configured to determine a rotation amount of the component handling tools based on the tool offset amount and the component push location data; and control circuitry configured to send to the tool rotation device actuation signals to rotate the component handling tools the determined rotation amount and to send actuation signals to the component handling tools to push the component at the determined push locations after the component has been mounted on the board. 8. The component mounter according to claim 7 , further comprising: two heads each provided with the two mounting units, the two heads mounted in the component mounter side-by-side.

Assignees

Inventors

Classifications

  • Holders for printed circuit boards · CPC title

  • H05K13/08Primary

    Monitoring manufacture of assemblages · CPC title

  • Incorporating a pick-up tool · CPC title

  • Sucking devices · CPC title

  • having multiple pick-up tools · CPC title

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Frequently asked questions

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What does patent US10667451B2 cover?
A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section…
Who is the assignee on this patent?
Fuji Corp
What technology area does this patent fall under?
Primary CPC classification H05K13/08. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 26 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).