Implementing contained thermal interface material for pluggable applications

US10667433B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10667433-B2
Application numberUS-201815996834-A
CountryUS
Kind codeB2
Filing dateJun 4, 2018
Priority dateJun 4, 2018
Publication dateMay 26, 2020
Grant dateMay 26, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management applications.

First claim

Opening claim text (preview).

What is claimed is: 1. A structure for implementing thermal coupling, comprising: a thermal interface material in contact with a surface of a connector housing; a metal member coupled to the connector housing, wherein the metal member is a compressible metal mesh or a perforated spring-actuated shield, and wherein the thermal interface material and the metal member provide effective thermal coupling between the connector housing and a pluggable component; and wherein the metal member prevents removal of the thermal interface material during plugging and unplugging of the pluggable component, and enables effective contact and heat transfer between the connector housing and the pluggable component. 2. The structure as recited in claim 1 , wherein the pluggable component is a cable. 3. The structure as recited in claim 1 , wherein the metal member is wear resistant and rebounds when the pluggable component is plugged into the connector housing. 4. The structure as recited in claim 1 , wherein the metal member is formed of a selected thermally conductive metal including one of copper, a copper alloy, aluminum, an aluminum alloy, steel, a conductive ceramic material, and a conductive polymeric material. 5. The structure as recited in claim 1 , wherein the thermal interface material is formed of a selected thermal interface material including one of a putty, a grease, and a pad thermal interface material. 6. The structure as recited in claim 1 , wherein the connector housing is a printed circuit board (PCB) connector housing and the pluggable component is a cable. 7. The structure as recited in claim 2 , wherein the cable is a fiber optic cable. 8. The structure as recited in claim 1 , wherein the metal member is coated with a hydrophobic coating. 9. The structure as recited in claim 1 , wherein the compressible metal mesh is impregnated with the thermal interface material. 10. The structure as recited in claim 1 , wherein the compressible metal mesh is disposed on a surface of the thermal interface material. 11. A method for implementing thermal coupling, comprising: providing a pluggable cable component and a connector housing; providing a thermal interface material in contact with a surface of the connector housing; coupling a metal member to the connector housing, wherein the metal member is a compressible metal mesh or a perforated spring-actuated shield; using the thermal interface material and the metal member for providing effective thermal coupling between the connector housing and the pluggable component during plugging and unplugging of the pluggable component; and using the metal member to prevent removal of the thermal interface material during the plugging and unplugging. 12. The method as recited in claim 11 , wherein the pluggable component is a cable. 13. The method as recited in claim 11 , wherein the metal member is formed of a selected thermally conductive metal including one of copper, a copper alloy, aluminum, an aluminum alloy, steel, a conductive ceramic material, and a conductive polymeric material. 14. The method as recited in claim 11 , wherein the perforated spring-actuated shield shifts to make contact with the thermal interface material when the pluggable component is plugged into the connector housing. 15. A structure for implementing thermal coupling, comprising: a connector housing and a mating cable, wherein the mating cable is plugged into the connector housing; a thermal interface material in contact with the mating cable and a surface of the connector housing; a metal member in contact with the thermal interface material and disposed between the mating cable and the connector housing, wherein the metal member is a compressible metal mesh or a perforated spring-actuated shield; wherein the thermal interface material and the metal member provide effective thermal coupling between the connector housing and the mating cable; and wherein the metal member prevents removal of the thermal interface material during plugging and unplugging of the mating cable.

Assignees

Inventors

Classifications

  • from steel or ferrous alloys · CPC title

  • G02B6/4268Primary

    Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

  • of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title

  • from copper or copper alloys · CPC title

  • from aluminium or aluminium alloys · CPC title

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Frequently asked questions

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What does patent US10667433B2 cover?
A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management app…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G02B6/4268. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 26 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).