Fully encapsulated electronics and printed circuit boards

Patent metadata

Field	Value
Publication number	US-10667408-B2
Application number	US-201916270721-A
Country	US
Kind code	B2
Filing date	Feb 8, 2019
Priority date	May 18, 2017
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

First claim

What is claimed is:

1. A method of encapsulating and hermetically sealing a printed circuit board of a flex cable, the method comprising:
positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate;
mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold;
filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold; and
curing the encapsulation material within the cavity of the mold while under vacuum.

2. The method according to claim 1 , further comprising positioning arm portions of the flex cable in grooves defined in the first mold half, the grooves extending from opposed sides of the channel.

3. The method according to claim 2 , wherein mounting the second mold half onto the first mold half further includes retaining the arm portions under tension between the first and second mold halves such that the printed circuit board portion of the flex cable is disposed in spaced relation relative to inner surfaces of the first and second mold halves defining the cavity of the mold.

4. The method according to claim 3 , wherein filling the cavity of the mold further includes completely covering the printed circuit board portion of the flex cable with the encapsulation material.

5. The method according to claim 1 , wherein filling the cavity of the mold further includes filling the cavity until the encapsulation material vents through an outlet opening defined through the mold.

6. The method according to claim 1 , further comprising:
opening the mold after the encapsulation material has solidified within the cavity; and
removing the flex cable from the mold.

7. The method according to claim 6 , further comprising clamping outer edges of the encapsulation material to enhance the bond between the encapsulation material and the flex cable.

8. The method according to claim 1 , further comprising attaching a rigidizing layer to the substrate of the printed circuit board portion of the flex cable prior to positioning the printed circuit board portion into the channel of the first mold half.

9. A method of encapsulating and hermetically sealing electronic components of a flex cable assembly and integrating the flex cable assembly into a surgical device, comprising:
positioning a printed circuit board portion of a flex cable assembly into a channel defined in a first housing half of an encapsulation housing, the printed circuit board portion including a substrate of a first flex cable of the flex cable assembly and electronic components mounted on the substrate;
mounting a second housing half onto the first housing half to enclose the channel of the first housing half and form a cavity within the encapsulation housing;
filling the cavity of the encapsulation housing with an encapsulation material through an inlet opening defined through the encapsulation housing;
connecting an electrical contact region of a second flex cable of the flex cable assembly to a rigid printed circuit board;
positioning a second encapsulation housing over the rigid printed circuit board such that electronic components of the rigid printed circuit board and the electrical contact region of the second flex cable are disposed within a cavity defined between the second encapsulation housing and the rigid printed circuit board; and
filling the cavity with an encapsulation material through an inlet opening defined through the second encapsulation housing.

10. The method according to claim 9 , further comprising positioning arm portions of the flex cable through cut-outs defined in side surfaces of the first housing half of the encapsulation housing.

11. The method according to claim 9 , wherein the printed circuit board portion of the flex cable assembly is disposed in spaced relation relative to the inner surfaces of the first and second housing halves defining the cavity of the encapsulation housing and filling the cavity of the encapsulation housing further includes completely covering the printed circuit board portion of the flex cable assembly with the encapsulation material.

12. The method according to claim 11 , wherein the inner surface of the first housing half includes standoffs disposed thereon to maintain space between the printed circuit board portion of the flex cable assembly and the inner surface of the first housing half, and positioning the printed circuit board portion into the channel further includes positioning the printed circuit board portion on top of the standoffs.

13. The method according to claim 9 , wherein filling the cavity of the encapsulation housing further includes filling the cavity until the encapsulation material vents through an outlet opening defined through the encapsulation housing.

14. The method according to claim 13 , further comprising orienting the encapsulation housing so that the inlet opening is lower than the outlet opening prior to filling the cavity with the encapsulation material.

15. The method according to claim 9 , further comprising curing the encapsulation material within the encapsulation housing and attaching the encapsulation housing to a component disposed within a surgical device.

16. The method according to claim 15 , wherein attaching the encapsulation housing to the component further includes placing the flex cable assembly and the encapsulation housing into an adapter assembly of the surgical device.

17. The method according to claim 9 , further comprising curing the encapsulation material within the second encapsulation housing and attaching the second encapsulation housing to a component disposed within a surgical device.

18. A method of encapsulating and hermetically sealing a printed circuit board of a flex cable, the method comprising:
positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate;
mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold;
filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold;
opening the mold after the encapsulation material has solidified within the cavity;
removing the flex cable from the mold; and
clamping outer edges of the encapsulation material to enhance the bond between the encapsulation material and the flex cable.

19. A method of encapsulating and hermetically sealing a printed circuit board of a flex cable, the method comprising:
positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate;
mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold;
filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold; and
attaching a rigidizing layer to the substrate of the printed circuit board portion of the flex cable prior to positioning the printed circuit board portion into the channel of the first mold half.

Assignees

• Covidien Lp

Inventors

• Sgroi Jr Anthony
• Mozdzierz Patrick
• Paul Stephen
• Valentine David
• Firth Scott

Classifications

• A61B2017/00398

  using powered actuators, e.g. stepper motors, solenoids · CPC title

• B29C45/14549

  Coating rod-like, wire-like or belt-like articles (B29C45/14426 takes precedence) · CPC title

• A61B17/07207

  the staples being applied sequentially · CPC title

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• A61B2017/00473

  Distal part, e.g. tip or head (A61B2017/00464 takes precedence) · CPC title