Interposer substrate and multilayer printed substrate

Patent metadata

Field	Value
Publication number	US-10667395-B2
Application number	US-201816126513-A
Country	US
Kind code	B2
Filing date	Sep 10, 2018
Priority date	Jan 16, 2018
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

According to one embodiment, an interposer substrate for switching wiring lines, includes a substrate body having through holes penetrating from a first main surface thereof to a second main surface, through-conductive portions provided respectively in the through holes, grouped into first groups and second groups different from the first groups, first wiring lines each provided on the first main surface and for a respective one of the first groups, second wiring lines each provided on the second main surface and for a respective one of the second groups, first terminals provided on the first main surface and connected respectively to the first wiring lines, and second terminals provided on the second main surface and connected respectively to the second wiring lines.

First claim

What is claimed is:

1. An interposer substrate for switching wiring lines, comprising: a substrate body having a plurality of through holes penetrating from a first main surface thereof to a second main surface; a plurality of through-conductive portions provided respectively in the plurality of through holes, grouped into a plurality of first groups and a plurality of second groups different from the first groups, each of all the through-conductive portions belonging to a corresponding one of the first groups and a corresponding one of the second groups; a plurality of first wiring lines each provided on the first main surface, each provided for a respective one of the plurality of first groups, and each including a portion extending along the through-conductive portions included in the respective one of the first groups; a plurality of second wiring lines each provided on the second main surface, each provided for a respective one of the plurality of second groups, and each including a portion extending along the through-conductive portions included in the respective one of the second groups; a plurality of first terminals provided on the first main surface and connected respectively to the plurality of first wiring lines; and a plurality of second terminals provided on the second main surface and connected respectively to the plurality of second wiring lines, wherein any through-conductive portion and any first wiring line, which is provided for a first group to which the any through-conductive portion belongs, are electrically connectable to each other by a first connection structure provided on the first main surface, and the first connection structure includes a first connection portion projecting from the any through-conductive portion and a second connection portion projecting from the any first wiring line, and wherein none of the through-conductive portions is directly electrically connected to any one of the first wiring lines.

2. The substrate of claim 1 , wherein
the plurality of through-conductive portions are arranged in a grid.

3. The substrate of claim 1 , wherein
the first wiring lines and the second wiring lines cross each other as viewed from a direction perpendicular to the first main surface and the second main surface.

4. The substrate of claim 1 , wherein
the first terminals and the second terminals are located at same positions, respectively, as viewed from a direction perpendicular to the first main surface and the second main surface.

5. A multilayer printed substrate comprising:
an interposer substrate for switching wiring lines, comprising:
a substrate body having a plurality of through holes penetrating from a first main surface thereof to a second main surface;
a plurality of through-conductive portions provided respectively in the plurality of through holes, grouped into a plurality of first groups and a plurality of second groups different from the first groups, each of all the through-conductive portions belonging to a corresponding one of the first groups and a corresponding one of the second groups;
a plurality of first wiring lines each provided on the first main surface each provided for a respective one of the plurality of first groups, and each including a portion extending along the through-conductive portions included in the respective one of the first groups;
a plurality of second wiring lines each provided on the second main surface each provided for a respective one of the plurality of second groups, and each including a portion extending along the through-conductive portions included in the respective one of the second groups;
a plurality of first terminals provided on the first main surface and connected respectively to the plurality of first wiring lines;
a plurality of second terminals provided on the second main surface and connected respectively to the plurality of second wiring lines;
a first printed substrate having a plurality of third terminals electrically connected respectively to the plurality of first terminals; and
a second printed substrate having a plurality of fourth terminals electrically connected respectively to the plurality of second terminals,
wherein the interposer substrate is provided between the first printed substrate and the second printed substrate, and
wherein a predetermined one of the through-conductive portions and a predetermined one of the first wiring lines, which is provided for a predetermined one of the first groups to which the predetermined through-conductive portion belongs, are electrically connected to each other by a first connection structure provided on the first main surface, the first connection structure includes a first connection portion projecting from the predetermined through-conductive portion and a second connection portion projecting from the predetermined first wiring line, and the through-conductive portions, other than the predetermined through-conductive portion, which are included in the predetermined first group are not electrically connected to the predetermined first wiring line.

6. The substrate of claim 5 , further comprising:
a first connection member interposed between the first terminals and the third terminals; and
a second connection member interposed between the second terminals and the fourth terminals.

7. The substrate of claim 5 , wherein
the plurality of through-conductive portions are arranged in a grid.

8. The substrate of claim 5 , wherein
the first wiring lines and the second wiring lines cross each other as viewed from a direction perpendicular to the first main surface and the second main surface.

9. The substrate of claim 5 , wherein
the first terminals and the second terminals are located at same positions, respectively, as viewed from a direction perpendicular to the first main surface and the second main surface.

10. The substrate of claim 1 , wherein
any one of the first wiring lines is not electrically connected to any one of the second wiring lines.

11. The substrate of claim 1 , wherein the any through-conductive portion and any second wiring line, which is provided for a second group to which the any through-conductive portion belongs, are electrically connectable to each other by a second connection structure provided on the second main surface, and the second connection structure includes a third connection portion projecting from the any through-conductive portion and a fourth connection portion projecting from the any second wiring line, and none of the through-conductive portions is directly electrically connected to any one of the second wiring lines.

12. The substrate of claim 1 , wherein
the number of the through-conductive portions included in each of the first groups and the number of the through-conductive portions included in each of the second groups are equal to each other.

13. The substrate of claim 5 , wherein
the predetermined one of the through-conductive portions and a predetermined one of the second wiring lines, which is provided for a predetermined one of the second groups to which the predetermined through-conductive portion belongs, are electrically connected to each other by a second connection structure provided on the second main surface, the second connection structure includes a third connection portion projecting from the predetermined through-conductive portion and a fourth connection portion projecting from the predetermined second wiring line, and the through-conductive portions, other than the predetermined through-conductive portion, which are included in the predetermined second group are not electrically connected to the predetermined second wiring line.

Assignees

• Toshiba Electronic Devices & Storage Corp

Inventors

• Ninomiya Ryoji
• Agawa Kenichi

Classifications

• H05K2201/10378

  Interposers · CPC title

• H05K1/144 Primary

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K2201/041

  Stacked PCBs, i.e. having neither an empty space nor mounted components in between · CPC title

• H05K3/368 Primary

  parallel to each other (H05K3/361 takes precedence) · CPC title