Degenerated transimpedance amplifier with wire-bonded photodiode for reducing group delay distortion

Patent metadata

Field	Value
Publication number	US-10666203-B2
Application number	US-201816157772-A
Country	US
Kind code	B2
Filing date	Oct 11, 2018
Priority date	Sep 28, 2016
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

An integrated circuit includes a degeneration network configured to improve group delay across one or more variations, wherein the degeneration network includes a transimpedance amplifier with one or more degeneration inductors. The transimpedance amplifier further includes one or more transistors, and the one or more degeneration inductors are connected after at least one emitter of the one or more transistors.

First claim

What is claimed is:

1. A method for improving group delay across one or more variations corresponding to a transimpedance amplifier, the method comprising:
producing a degeneration impedance by a degeneration inductor;
wherein the transimpendance amplifier comprises an inverting amplifier including the degeneration inductor;
monitoring the degeneration impedance through a tracking feedback loop; and
adjusting an inductance of the degeneration inductor to alter the degeneration impedance in response to the one more variations;
wherein the inverting amplifier comprises:
a first transistor coupled to a positive voltage input; and
a second transistor coupled to a negative voltage input;

wherein the degeneration inductor is connected between emitters of the first and second transistors.

2. The method according to claim 1 , wherein the one or more variations comprise at least one of bond wire length, process, voltage and temperature.

3. The method according to claim 1 , further comprising flattening a group delay profile over a frequency range, wherein the group delay profile corresponds to the inductance of the degeneration inductor.

4. The method according to claim 1 , wherein:
the transimpedance amplifier is electrically connected to a device via a bond wire; and
the degeneration impedance flattens the group delay associated with an inductance of the bond wire.

5. The method according to claim 4 , wherein the device is a photodiode.

6. A method for improving group delay across one or more variations corresponding to a transimpedance amplifier, the method comprising:
producing, by one or more inductors, a degeneration impedance;
wherein the transimpendance amplifier comprises an inverting amplifier including the one or more inductors;
monitoring the degeneration impedance; and
adjusting an inductance of the one or more inductors to alter the degeneration impedance in response to the one more variations;
wherein the inverting amplifier comprises:
a first transistor coupled to a positive voltage input; and
a second transistor coupled to a negative voltage input;

wherein the one or more inductors are connected between emitters of the first and second transistors.

7. The method according to claim 6 , wherein the one or more variations comprise at least one of bond wire length, process, voltage and temperature.

8. The method according to claim 6 , further comprising flattening a group delay profile over a frequency range, wherein the group delay profile corresponds to the inductance of the one or more inductors.

9. The method according to claim 6 , wherein:
the transimpedance amplifier is electrically connected to a device via a bond wire; and
the degeneration impedance flattens the group delay associated with an inductance of the bond wire.

10. The method according to claim 9 , wherein the device is a photodiode.

11. The method according to claim 1 , wherein:
a first resistor is coupled to a junction of a first one of the emitters and a first end of the degeneration inductor; and
a second resistor is coupled to a junction of a second one of the emitters and a second end of the degeneration inductor.

12. The method according to claim 6 , wherein:
a first resistor is coupled to a junction of a first one of the emitters and a first end of an inductor of the one or more inductors; and
a second resistor is coupled to a junction of a second one of the emitters and a second end of the inductor of the one or more inductors.

Assignees

• IBM

Inventors

• Lee Wooram
• Proesel Jonathan E

Classifications

• H03F3/45085

  Long tailed pairs (H03F3/45112, H03F3/45139 take precedence) · CPC title

• H03F2203/45034

  One or more added reactive elements, capacitive or inductive elements, to the amplifying transistors in the differential amplifier · CPC title

• H03F2203/45288

  Differential amplifier with circuit arrangements to enhance the transconductance · CPC title

• H03F1/34 Primary

  Negative-feedback-circuit arrangements with or without positive feedback (H03F1/02 - H03F1/30, H03F1/38 - H03F1/50, H03F3/50 take precedence {; for rejection of common mode signals H03F3/45479}) · CPC title

• H04B10/693 Primary

  Arrangements for optimizing the preamplifier in the receiver · CPC title