Method for making high-temperature superconducting film
US-2015380130-A1 · Dec 31, 2015 · US
US10665367B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10665367-B2 |
| Application number | US-201615767420-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 12, 2016 |
| Priority date | Oct 15, 2015 |
| Publication date | May 26, 2020 |
| Grant date | May 26, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An oxide superconducting wire includes an oriented metal substrate, an intermediate layer formed on the oriented metal substrate, and an oxide superconducting layer formed on the intermediate layer. The oriented metal substrate has an in-plane orientation Δϕ of 7° or less. The intermediate layer is formed of a single layer.
Opening claim text (preview).
The invention claimed is: 1. An oxide superconducting wire comprising: an oriented metal substrate; an intermediate layer formed on the oriented metal substrate and being in contact with the oriented metal substrate; and an oxide superconducting layer formed on the intermediate layer and being in contact with the intermediate layer, the oriented metal substrate having an in-plane orientation (Δϕ) of 7° or less, and the intermediate layer being formed of a single layer having a thickness of 10 nm or more and 200 nm or less, wherein a value obtained by dividing a difference between an in-plane orientation of the intermediate layer and the in-plane orientation of the oriented metal substrate by the in-plane orientation of the oriented metal substrate, expressed as a percentage, is 15% or less. 2. The oxide superconducting wire according to claim 1 , wherein the intermediate layer has an in-plane orientation of 8° or less. 3. The oxide superconducting wire according to claim 2 , wherein the oriented metal substrate includes an oxide layer at a top portion in contact with the intermediate layer. 4. The oxide superconducting wire according to claim 1 , wherein the intermediate layer has a thickness of 10 nm or more. 5. The oxide superconducting wire according to claim 4 , wherein the intermediate layer has an in-plane orientation of 8° or less. 6. The oxide superconducting wire according to claim 4 , wherein the oriented metal substrate includes an oxide layer at a top portion in contact with the intermediate layer. 7. The oxide superconducting wire according to claim 1 , wherein the oriented metal substrate is a clad substrate. 8. The oxide superconducting wire according to claim 7 , wherein the intermediate layer has an in-plane orientation of 8° or less. 9. The oxide superconducting wire according to claim 7 , wherein the oriented metal substrate includes an oxide layer at a top portion in contact with the intermediate layer. 10. The oxide superconducting wire according to claim 1 , wherein the oriented metal substrate includes an oxide layer at a top portion in contact with the intermediate layer.
Films or wires on bases or cores · CPC title
Electric properties · CPC title
Compounds containing copper, with or without oxygen or hydrogen, and containing two or more other elements · CPC title
Compounds of copper · CPC title
Methods of preparing compounds of metals not covered by subclasses C01B, C01C, C01D, or C01F, in general (electrolytic production of inorganic compounds C25B1/00) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.