Molding material for forming structure and molding method

Patent metadata

Field	Value
Publication number	US-10661550-B2
Application number	US-201515320855-A
Country	US
Kind code	B2
Filing date	Jun 29, 2015
Priority date	Jun 27, 2014
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

Provided is a material for molding, without a mold, a highly uniform structure comprising a resin and a non-resin such as metals and ceramic. The molding material provided by this invention is formed of a powder comprising a resin and at least one species of non-resin selected among metals and ceramic. The resin material has a uniformity index N below 0.2. N is determined by depositting the powder in a softened or melted state to form a structure in a temperature range between the resin material's minimum molding temperature and maximum molding tempeature+100° C.; measuring the structure's porosity Rn at 12 locations by image analysis; and dividing the variance of porosity Rn by the average porosity Rn. The minimum and maximum molding temperatures are the lowest and highest heater temperatures at which the resin material can be molded at a pressure of 3500 psi by injection molding, respectively.

First claim

The invention claimed is:

1. A method for molding a structure without a mold, comprising:
obtaining a powdered molding material that comprises granulated particles formed from resin particles and non-resinous particles bonded to each other, the non-resinous particles formed of at least one material selected from the group consisting of metals and ceramics; and
depositing the molding material in layers on a molding table; and
heating until the layers of the molding material soften or melt only over an area corresponding to a cross section of an aimed structure;
the molding material being in a softened or molten state in a temperature range between the resin material's minimum molding temperature and maximum molding temperature+100° C.,
the minimum molding temperature is the lowest heater temperature at which the resin material can be molded at an injection pressure of 3500 psi by an injection molding machine, and
the maximum molding temperature is the highest heater temperature at which the resin material can be molded at an injection pressure of 3500 psi by the injection molding machine.

2. The structure-molding method according to claim 1 , wherein the molding material is deposited with the molding material being dispersed in a dispersion medium.

3. The structure-molding method according to claim 1 , wherein the molding material is deposited by a 3D printer to form the structure.

4. The structure-molding method according to claim 1 , wherein during the heating step, the molding material is heated to the temperature range between the resin material's minimum molding temperature and maximum molding temperature+100° C.

5. The structure-molding method according to claim 1 , wherein the depositing step and the heating step are repeated to obtain the aimed structure.

Assignees

• Fujimi Inc

Inventors

• Sato Kazuto
• Mizuno Hiroaki
• Ibe Hiroyuki
• Shinoda Fumi
• Ota Kyohei

Classifications

• B28B1/30

  by applying the material on to a core or other moulding surface to form a layer thereon (to form a permanent layer B28B19/00) · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• C08J5/00 Primary

  Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00) · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• B29C67/00

  Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 · CPC title