Ultrasound probe and ultrasound imaging device

US10660612B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10660612-B2
Application numberUS-201415325263-A
CountryUS
Kind codeB2
Filing dateJul 10, 2014
Priority dateJul 10, 2014
Publication dateMay 26, 2020
Grant dateMay 26, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An embodiment of the disclosure provides an ultrasound probe including a single large-area ASIC in which a plurality of ultrasonic transducer elements are bonded. According to an embodiment, an ultrasound probe comprises: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, wherein the integrated circuit comprises a time delay table configured to output time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements.

First claim

Opening claim text (preview).

The invention claimed is: 1. An ultrasound probe comprising: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, wherein the integrated circuit comprises a time delay table configured to output time delay information regarding respective ultrasound transmission and reception for each of the plurality of transducer elements, and wherein the time delay table is installed in an area other than an area where the transducer array is installed on the integrated circuit. 2. The ultrasound probe of claim 1 , wherein each of the plurality of driving elements comprises, an element memory configured to store the time delay information output from the time delay table; and a beamformer configured to perform beamforming based on the time delay information stored in the element memory. 3. The ultrasound probe of claim 1 , wherein each of the plurality of driving elements comprises, one of a transmit pulser configured to generate a pulse for ultrasound transmission of the transducer element and an amplifier configured to amplify an externally input pulse. 4. The ultrasound probe of claim 1 , wherein each of the plurality of driving elements comprises a pre-amplifier configured to amplify an echo ultrasound signal received by the transducer element. 5. The ultrasound probe of claim 1 , wherein the time delay table comprises a memory configured to store time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements. 6. The ultrasound probe of claim 1 , wherein the time delay table comprises a calculation unit configured to calculate time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements. 7. The ultrasound probe of claim 1 , further comprising: a printed circuit board where the integrated circuit is installed. 8. The ultrasound probe of claim 1 , wherein the transducer array comprises a plurality of transducer groups including the plurality of transducer elements. 9. The ultrasound probe of claim 8 , wherein the transducer groups are arranged in one of an one-dimensional (1D) array and a two-dimensional (2D) array, and the transducer elements included in the transducer group are arranged in one of a one-dimensional (1D) array and a two-dimensional (2D) array. 10. The ultrasound probe of claim 1 , wherein the transducer element comprises one of piezo-electronic transducer (PZT), capacitive micromachined ultrasonic transducer cMUT), monocrystal, and piezoelectric micromachined ultrasonic transducer (pMUT). 11. An ultrasound imaging device comprising: an ultrasound probe comprising: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound, an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, and a time delay table configured to output time delay information regarding respective ultrasound transmission and reception for each of the plurality of transducer elements; and a main body configured to generate an ultrasound image based on a signal output from the ultrasound probe, wherein the time delay table is installed in an area other than an area where the transducer array is installed on the integrated circuit. 12. The ultrasound imaging device of claim 11 , wherein each of the plurality of driving elements comprises, an element memory configured to store the time delay information output from the time delay table, and a beamformer configured to perform beamforming based on the time delay information stored in the element memory. 13. The ultrasound imaging device of claim 12 , wherein the beamformer is configured to output a beamformed signal to the main body, and wherein the main body comprises an image processor configured to receive the beamformed signal to generate an ultrasound image. 14. The ultrasound imaging device of claim 11 , wherein each of the plurality of driving elements comprises, a transmit pulser configured to generate a pulse for ultrasound transmission of the transducer element. 15. The ultrasound imaging device of claim 11 , wherein the main body comprises an ultrasound generation controller configured to output a pulse for ultrasound transmission of the transducer element, and wherein the ultrasound probe comprises an amplifier configured to amplify the pulse output from the ultrasound generation controller. 16. The ultrasound imaging device of claim 11 , wherein the time delay table comprises a memory configured to store time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements.

Assignees

Inventors

Classifications

  • Electrostatic or capacitive probes, e.g. electret or cMUT-probes · CPC title

  • involving processing of raw data to produce diagnostic data, e.g. for generating an image · CPC title

  • A61B8/4494Primary

    characterised by the arrangement of the transducer elements · CPC title

  • using multiple elements (B06B1/064 and B06B1/0688 take precedence) · CPC title

  • Diagnosis using ultrasonic, sonic or infrasonic waves · CPC title

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What does patent US10660612B2 cover?
An embodiment of the disclosure provides an ultrasound probe including a single large-area ASIC in which a plurality of ultrasonic transducer elements are bonded. According to an embodiment, an ultrasound probe comprises: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonde…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification A61B8/4494. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue May 26 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).