Modular assembly for multidimensional transducer arrays
US-2016271651-A1 · Sep 22, 2016 · US
Ultrasound transducer and manufacturing method thereof
US10658563B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10658563-B2 |
| Application number | US-201715643226-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2017 |
| Priority date | Jul 26, 2016 |
| Publication date | May 19, 2020 |
| Grant date | May 19, 2020 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.
First claim
Opening claim text (preview).
We claim: 1. An ultrasound transducer comprising: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer, wherein the backing layer comprises a connector that connects to a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector, the wiring area comprising conductors filling etched portions of the backing material of the backing layer. 2. The ultrasound transducer of claim 1 , wherein the backing block further comprises a ground area for connecting with the ground layer. 3. The ultrasound transducer of claim 2 , wherein the ground layer is connected to the ground area by using a flexible printed circuit board. 4. The ultrasound transducer of claim 1 , wherein the wiring area is formed by being etched by laser processing and by being filled with metal material as the conductors. 5. The ultrasound transducer of claim 1 , wherein the backing block comprises a predetermined ratio of oxide of metal of at least one of Cr, Fe, and Cu. 6. The ultrasound transducer of claim 5 , wherein the predetermined ratio is in a range of more than 0% to less than 21%.
Assignees
Inventors
Classifications
Application to multi-element transducer · CPC title
using a single piezoelectric element (B06B1/0688 takes precedence) · CPC title
on the back only of piezoelectric elements · CPC title
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10658563B2 cover?
- An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of…
- Who is the assignee on this patent?
- Siemens Medical Solutions Usa Inc
- What technology area does this patent fall under?
- Primary CPC classification H01L41/047. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 19 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).