Apparatus and method for component positining

Patent metadata

Field	Value
Publication number	US-10658209-B2
Application number	US-201615548801-A
Country	US
Kind code	B2
Filing date	Feb 2, 2016
Priority date	Feb 6, 2015
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

Apparatus (200, 300, 400) for component positioning comprises at least one receptacle (212, 412) configured to receive a number of components (103) to be placed on a target substrate (108, 111), agitator (210, 410) configured to exert force impulses, such as abrupt force impulses, on the receptacle so as to cause the components to change their position inside the receptacle, inspection equipment (216, 316, 416) configured to verify the position of the components inside the receptacle, and pick and place equipment (206, 306, 406) configured to pick one or more components from the receptacle that fulfil a predefined position criterion and place the components on the target substrate. A related method for component positioning is presented.

First claim

The invention claimed is:

1. An apparatus for component positioning, comprising:
a receptacle configured to receive a number of components to be placed on a target substrate,
agitator configured to exert force impulses on the receptacle so as to cause the components to change their position including turning over inside the receptacle;
inspection equipment configured to verify the position of the components inside the receptacle to identify one or more components that fulfill a predefined position criterion from the remaining components to be agitated more; and
pick and place equipment configured to pick said identified one or more components from the receptacle that fulfill the predefined position criterion and place the picked components on the target substrate while leaving the remaining components in the receptacle for further agitation.

2. The apparatus of claim 1 , wherein the components include integrated circuits.

3. The apparatus of claim 2 , wherein the components include flip chips with bumps initially facing away from a receptacle surface such that responsive to agitation, the bumps are facing the receptacle surface thereby rendering the chips suitable for placement on the target substrate without further flipping.

4. The apparatus of claim 1 , wherein the receptacle comprises a tray.

5. The apparatus of claim 1 , wherein the receptacle comprises elastic material at the contact surface of the components.

6. The apparatus of claim 1 , wherein the agitator comprises at least one element selected from the group consisting of vibration element, vibrating motor, ac motor, dc motor, unbalanced motor, piezoelectric element, hydraulic element, servo motor, and pneumatic element.

7. The apparatus of claim 1 , wherein the inspection equipment comprises a computer vision system with at least one camera and image analyzer.

8. The apparatus of claim 1 , wherein the pick and place equipment comprises or is integrated with at least one element selected from the group consisting of actuator, multi-head actuator, robotic arm, heater, flux dispenser, suction nozzle, and camera.

9. The apparatus of claim 1 , further comprising feeding equipment configured to provide the receptacle with the components from a source carrier.

10. The apparatus of claim 1 , further comprising a heater configured to heat the picked components.

11. The apparatus of claim 1 , further comprising a flux dispenser configured to provide flux on the components or on the target substrate.

12. The apparatus of claim 1 , wherein the target substrate has a supplementary layer or structure thereon.

13. The apparatus of claim 1 , further comprising printing equipment configured to print a number of conductors on the target substrate.

14. The apparatus of claim 1 , wherein the target substrate for which the apparatus has been configured comprises at least one element selected from the group consisting of sheet, film, plastic film, foil, web, plastics, fiber, paper, cardboard, fabric, wood, felt, metal, organic material, and biological material.

15. The apparatus of claim 1 , wherein said force impulses comprise abrupt force impulses.

16. The apparatus of claim 1 , further comprising feeding equipment configured to provide the receptacle with the components from a dicing membrane.

17. A method for component positioning comprising:
locating a number of components to be finally placed on a target substrate, in a component receptacle;
intermittently exerting force on the receptacle so as to cause the components to change their position including turning over within the receptacle;
verifying the position of the components within the receptacle, identifying one or more components that fulfill a predefined position criterion from the remaining components to be agitated more; and
picking said identified one or more components from the receptacle that fulfill the predefined position criterion according to the verification, and placing the components on the target substrate while leaving the remaining components in the receptacle for further agitation.

18. The method of claim 17 , wherein verifying comprises image analysis of camera data.

19. The method of claim 17 , comprising heating the picked components.

20. The method of claim 17 , further comprising printing a number of conductors on the target substrate.

Assignees

• Stora Enso Oyj

Inventors

• Maijala Juha
• Sirvio Petri
• Jokinen Tommi

Classifications

• H05K2201/10674

  Flip chip · CPC title

• H05K13/046

  Surface mounting (surface mounted components H05K3/341) · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K13/022 Primary

  with orientation of the elements · CPC title