Capacitive block including a heat sink

Patent metadata

Field	Value
Publication number	US-10658110-B2
Application number	US-201916553673-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Sep 4, 2018
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

The invention relates to a capacitive block, notably for an electrical equipment, comprising a case, a capacitive element housed in the case, a substance filling the space between the case and the capacitive element so as to ensure leak tightness of the capacitive element, a heat sink against which the capacitive element is in direct contact. In the capacitive block, the heat sink is different from the filling substance, a face of said heat sink, designated free face, forming an outer face of the capacitive block and being devoid of said filling substance.

First claim

The invention claimed is:

1. A capacitive block, notably for an electrical equipment, comprising:
a case,
a capacitive element housed in the case,
a substance filling the space between the case and the capacitive element so as to ensure leak tightness of the capacitive element,
a heat sink against which the capacitive element is in direct contact,

capacitive block in which the heat sink is different from the filling substance,
a face of said heat sink, designated free face, forming an outer face of the capacitive block and being devoid of said filling substance.

2. The capacitive block according to claim 1 , in which the heat sink has a thermal conductivity greater than that of the filling substance.

3. The capacitive block according to claim 1 , in which the heat sink comprises a plate of which a face opposite to the capacitive element forms said free face of the heat sink.

4. The capacitive block according to claim 1 , in which the filling substance extends to a height less than the height of the free face of the heat sink, said heights being defined with respect to a bottom of the case.

5. The capacitive block according to claim 1 , in which the heat sink comprises a thermally conductive and dielectric interface layer forming a contact of the heat sink with the capacitive element.

6. The capacitive block according to claim 5 , in which the heat sink comprises a plate of which a face opposite to the capacitive element forms said free face of the heat sink and in which said interface layer has an overextending portion around said plate.

7. The capacitive block according to claim 1 , in which the capacitive element comprises at least one electrical connection tab, said tab forming a contact face of the capacitive element with the heat sink and said tab electrically connecting to an electrode of the capacitive element by a face opposite to its contact face.

8. The capacitive block according to claim 1 , in which the case includes a wall forming a bottom of the case, from which walls extend forming side walls of the case, said bottom and said side walls defining a housing receiving said capacitive element, and a face of the capacitive element opposite to the bottom of the case forming a face coming directly against the heat sink.

9. An assembly including the capacitive block according to claim 1 , assembled with a cooling circuit which is configured to receive a fluid configured to drain heat from the capacitive block,
said free face of the heat sink coming against a face of said cooling circuit.

10. A method for assembling a capacitive block including:
the positioning of a capacitive element in a case through an opening of the case,
the positioning of a heat sink against a face of the capacitive element facing said opening of the case,
the deposition of a substance ensuring leak tightness of the capacitive element by filling the space between the capacitive element and the case, with the exception of a zone including a face of the heat sink, designated free face, which is opposite to the capacitive element and which forms an outer face of the capacitive block.

Assignees

• Valeo Siemens Eautomotive France Sas

Inventors

• Parigot Baptiste
• Moceri Alwin

Classifications

• H01G2/08 Primary

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title

• H01G13/003

  Apparatus or processes for encapsulating capacitors · CPC title

• H01G2/103

  Sealings, e.g. for lead-in wires; Covers · CPC title

• H01G4/38 Primary

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/002

  Details · CPC title