Air-based cooling for data center rack

US10655771B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10655771-B2
Application numberUS-201815919944-A
CountryUS
Kind codeB2
Filing dateMar 13, 2018
Priority dateMar 14, 2007
Publication dateMay 19, 2020
Grant dateMay 19, 2020

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.

First claim

Opening claim text (preview).

What is claimed: 1. An apparatus for use in a closed-loop, air-based coolant circuit, comprising: a conduit assembly comprising: a delivery passageway for delivery of coolant air from a cooling unit to a heat exchange site where the coolant air is warmed due to heat exchange; and a return flow passageway for delivery of the coolant air from the heat exchange site to the cooling unit; and a reed valve subassembly configured to obstruct air flow associated with the delivery passageway when a first conduit section of the delivery passageway is disconnected from a second conduit section of the delivery passageway, wherein: the first conduit section comprises the reed valve subassembly; and each valve finger is operatively associated with a respective lever arm extending from a portion of an outer surface of the first conduit section. 2. The apparatus of claim 1 , wherein: the reed valve subassembly is biased toward the closed configuration wherein each lever arm extends outward from the portion of the outer surface of the first conduit section. 3. The apparatus of claim 2 , wherein: the second conduit section comprises a flanged section dimensioned to extend over the portion of the outer surface of the first conduit section such that each lever arm is depressed by the flanged section when the first conduit section and second conduit section are connected to open the reed valve.

Assignees

Inventors

Classifications

  • the movable closure member being pivotally supported at one point and being linked to the operating lever at only one other point · CPC title

  • F16L37/38Primary

    with fluid cut-off means in only one of two pipe-end fittings · CPC title

  • the conduits being arranged one within the other, e.g. concentrically {(multiple wall tubes for leak detection F28F1/003)} · CPC title

  • Thermal management, e.g. server temperature control · CPC title

  • with a gate valve or sliding valve · CPC title

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Frequently asked questions

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What does patent US10655771B2 cover?
A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, e…
Who is the assignee on this patent?
Zonit Structured Solutions Llc
What technology area does this patent fall under?
Primary CPC classification F16L37/38. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 19 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).