Liquid blow molding apparatus and liquid blow molding method

US10654212B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10654212-B2
Application numberUS-201615570695-A
CountryUS
Kind codeB2
Filing dateMar 10, 2016
Priority dateApr 30, 2015
Publication dateMay 19, 2020
Grant dateMay 19, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A liquid blow molding apparatus including a support pin disposed in a blow mold. The support pin includes a head and a shaft. The support pin is configured to define a gap between the head and a bottom of the preform in a state where the preform is placed in the blow mold and is also configured to support the bottom of the preform at a time of a molding process and to be displaced downward in accordance with deformation of the preform.

First claim

Opening claim text (preview).

The invention claimed is: 1. A liquid blow molding method for liquid blow molding a preform into a container in a blow mold and supplying a liquid that has been pressurized to a predetermined pressure into the preform, the preform having been formed in a bottomed tubular shape, the liquid blow molding method comprising: using a liquid blow molding apparatus comprising a support pin disposed in the blow mold to support a bottom of the preform by the support pin by contacting a head of the support pin and the bottom of the preform at a time of a molding process when the preform is stretched in an axial direction of the preform and displace the support pin downward in accordance with deformation of the preform caused by liquid blow molding, wherein the support pin includes the head configured to support the bottom of the preform from an outer side of the preform and a shaft that is connected to the head and that is displaceable upward and downward in the axial direction of the preform, the support pin is configured to define a gap between the head and the bottom of the preform, the head and the preform spaced from each other when the preform is in a most ascended position where the preform is placed in the blow mold and the support pin is displaced most upward prior to stretching the preform and the support pin is configured to support the bottom of the preform when the preform is stretched by an amount of the gap in the axial direction, and the gap and a below-neck length that is an axial length from a lower surface of a neck ring to an end of the bottom of the preform satisfy the following formula (A): 0<gap≤0.44×below-neck length . . . (A). 2. The liquid blow molding method of claim 1 , wherein the preform is stretched in the axial direction by using a stretching rod included in the liquid blow molding apparatus, and the stretching rod is inserted into the inside of the preform to stretch the preform in the axial direction. 3. The liquid blow molding method of claim 2 , wherein the stretching rod is configured to be in contact with the bottom of the preform while the liquid is supplied into the preform. 4. The liquid blow molding method of claim 2 , wherein the liquid is supplied after the bottom of the preform is sandwiched between the stretching rod and the head of the support pin.

Assignees

Inventors

Classifications

  • staying in the final article · CPC title

  • Bottles · CPC title

  • characterised by using particular environment or blow fluids other than air · CPC title

  • B29C49/42Primary

    Component parts, details or accessories; Auxiliary operations · CPC title

  • Operations & Transport · mapped topic

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10654212B2 cover?
A liquid blow molding apparatus including a support pin disposed in a blow mold. The support pin includes a head and a shaft. The support pin is configured to define a gap between the head and a bottom of the preform in a state where the preform is placed in the blow mold and is also configured to support the bottom of the preform at a time of a molding process and to be displaced downward in a…
Who is the assignee on this patent?
Okuyama Yuichi, Suyama Kenichi, Yoshino Kogyosho Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C49/42. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 19 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).