Resin molding and method for producing the same

US10654202B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10654202-B2
Application numberUS-201815949725-A
CountryUS
Kind codeB2
Filing dateApr 10, 2018
Priority dateApr 14, 2017
Publication dateMay 19, 2020
Grant dateMay 19, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a resin molding in which two types of substrates have a connection part constituted of a thin part provided from the one substrate to the other substrate with a boundary defined by end surfaces of the respective substrates, wherein the density of the one substrate in the connection part is higher than the density of a base part excluding the connection part. The resin molding can have a configuration in which the one substrate is a plate-like substrate including reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other and the other substrate is an injection-molded member connected along the plate face direction of the one substrate from an end surface of the one substrate. Moreover, it is preferred that the connection part have, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends and the connection interface be located at an intermediate part of the part that is gradually thinned. It is preferred that the reinforcing fibers be plant fibers, such as kenaf.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin molding in which two types of substrates are connected to each other on the end surfaces thereof, wherein the resin molding has a connection part constituted of a thin part provided from the one substrate to the other substrate with a boundary defined by the end surfaces, wherein the density of the one substrate in the connection part is higher than the density of a base part, the base part being a region of the one substrate excluding the connection part, wherein the one substrate is a plate-like substrate comprising reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other, wherein the other substrate is an injection-molded member connected along the plate face direction of the one substrate from an end surface of the one substrate, and wherein the reinforcing fibers are plant fibers. 2. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends. 3. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends, and the end surfaces are located at an edge part of the part that is gradually thinned. 4. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the one substrate, a section gradually thinned from a position at which the connection part extends. 5. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends, and wherein the connection part has, on the side thereof closer to the one substrate, a section gradually thinned from a position at which the connection part extends. 6. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends, the end surfaces are located at an intermediate part of the part that is gradually thinned, and wherein the connection part has, on the side thereof closer to the one substrate, a section gradually thinned from a position at which the connection part extends. 7. The resin molding according to claim 1 , wherein the connection part has, on the side thereof closer to the other substrate, a section gradually thinned from a position at which the connection part extends, the end surfaces are located at an edge part of the part that is gradually thinned, and wherein the connection part has, on the side thereof closer to the one substrate, a section gradually thinned from a position at which the connection part extends. 8. The resin molding according to claim 1 , wherein the first thermoplastic resin and a second thermoplastic resin contained in the other substrate are the same type of thermoplastic resin. 9. A method for producing a resin molding according to claim 1 , comprising: a shaping step of shaping the one substrate, and an injection-molded member molding step of injecting a thermoplastic resin composition against the end surface of the one substrate shaped, thereby connecting the other substrate, wherein in the injection-molded member molding step, there is arranged a mold for forming the connection part at a region that is to become the connection part.

Assignees

Inventors

Classifications

  • Doors · CPC title

  • Use of cellulose, modified cellulose or cellulose derivatives, e.g. viscose, as reinforcement · CPC title

  • including variation in thickness · CPC title

  • Plastic parts manufactured by moulding · CPC title

  • Thermoplastic materials · CPC title

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What does patent US10654202B2 cover?
Provided is a resin molding in which two types of substrates have a connection part constituted of a thin part provided from the one substrate to the other substrate with a boundary defined by end surfaces of the respective substrates, wherein the density of the one substrate in the connection part is higher than the density of a base part excluding the connection part. The resin molding can ha…
Who is the assignee on this patent?
Toyota Boshoku Kk
What technology area does this patent fall under?
Primary CPC classification B29C45/14467. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 19 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).