Method for constructing irrigated balloon catheter with flexible circuit electrode assembly

Patent metadata

Field	Value
Publication number	US-10653480-B2
Application number	US-201615360964-A
Country	US
Kind code	B2
Filing date	Nov 23, 2016
Priority date	Apr 28, 2016
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

A method of constructing an electrophysiology catheter having a flex circuit electrode assembly includes: providing a flex circuit having a substrate, a first conductive layer and a second conductive layer; removing the first conductive layer to expose a first surface of the substrate; forming the wiring electrode in the second conductive layer with one exclusion zone; forming a first through-hole in the substrate to provide one conductive via and forming a second through-hole to provide an irrigation aperture in alignment with the exclusion zone; forming the contact electrode on first surface of the substrate; placing conductive material into the first through-hole to form the conductive via, the conductive via extending through the substrate and electrically coupling the wiring electrode and the contact electrode; and coupling a first conductor and a second conductor to the wiring electrode to form a thermocouple.

First claim

What is claimed is:

1. A method of constructing a flexible circuit electrode assembly for use in assembling an electrophysiology balloon catheter adapted for use in an ostium, the method comprising:
providing a flex circuit having a substrate, a first conductive layer and a second conductive layer;
removing the first conductive layer to expose a first surface of the substrate;
forming a wiring electrode in the second conductive layer with one exclusion zone;
forming a first through-hole in the substrate to provide one conductive via and forming a second through-hole to provide an irrigation aperture in alignment with the exclusion zone;
forming a contact electrode on the first surface of the substrate,
wherein at least one of the forming the wiring electrode and the forming the contact electrode includes introducing conductive material into the first through-hole to form the conductive via, the conductive via extending through the substrate and electrically coupling the wiring electrode and the contact electrode.

2. The method of claim 1 , wherein the forming the contact electrode includes applying a seed layer and applying a second added conductive layer on the first surface of the substrate.

3. The method of claim 2 , wherein the applying the seed layer and applying a second added conductive layer includes applying the seed layer and the second added conductive layer in at least a region within a perimeter trace of the contact electrode.

4. The method of claim 2 , further includes:
applying a photoresist on the first surface of the substrate on a region outside of a perimeter trace of the contact electrode;
applying the seed layer on the first surface of the substrate on at least a region inside of the perimeter trace of the contact electrode;
applying a second added conductive layer on the first surface of the substrate on at least the region inside of the perimeter trace of the contact electrode; and
removing the photoresist from the first surface of the substrate.

5. The method of claim 1 , further including applying an added conductive layer on exposed conductive surfaces, after the forming the first and second through-holes in the substrate.

6. The method of claim 1 , further comprising applying an added conductive layer on exposed conductive surfaces on the substrate, the wiring electrode and the contact electrode, after the forming the contact electrode.

7. The method of claim 1 , further comprising conductively coupling a first and a second conductive lines of different metals to the wiring electrode.

8. The method of claim 1 , wherein the contact electrode is configured as a fishbone with an elongated portion and a plurality of transversal fingers.

9. The method of claim 1 , wherein the contact electrode and the wiring electrode includes gold.

10. A method of constructing an electrophysiology catheter adapted for use in an ostium, the catheter having a balloon having an membrane and a flex circuit electrode assembly, the method comprising:
providing a flex circuit having a substrate, a first conductive layer and a second conductive layer;
removing the first conductive layer to expose a first surface of the substrate;
forming a wiring electrode in the second conductive layer with one exclusion zone;
forming a first through-hole in the substrate to provide one conductive via and forming a second through-hole to provide an irrigation aperture in alignment with the exclusion zone;
forming a contact electrode on the first surface of the substrate;
placing conductive material into the first through-hole to form the conductive via, the conductive via extending through the substrate and electrically coupling the wiring electrode and the contact electrode;
coupling a first conductor and a second conductor to the wiring electrode to form a thermocouple;
affixing the flex circuit to the membrane with the wiring electrode between the substrate and the membrane.

11. The method claim 10 , further including applying a first added conductive layer on exposed conductive surfaces, after the forming the first and second through-holes in the substrate.

12. The method of claim 11 , further comprising applying a second added conductive layer on exposed conductive surfaces on the substrate, the wiring electrode and the contact electrode, after the forming the contact electrode.

13. The method of 10 , wherein the forming the contact electrode includes applying a seed layer and applying a second added conductive layer on the first surface of the substrate.

14. The method of claim 13 , wherein the applying the seed layer and applying a second added conductive layer includes applying the seed layer and the second added conductive layer in at least a region within a perimeter trace of the contact electrode.

15. The method of claim 10 , further including passing the first and second conductors of the thermocouple into an interior of the balloon through a through-hole formed in the membrane.

16. The method of claim 10 , further including placing the first and second conductors of the thermocouple between a tail of the flex circuit and the membrane.

17. The method of claim 10 , wherein the forming the wiring electrode includes forming an active solder pad.

18. The method of claim 10 , wherein the forming the wiring electrode includes forming an inactive solder pad.

19. The method of claim 10 , further includes:
applying a photoresist on the first surface of the substrate on a region outside of a perimeter trace of the contact electrode;
applying the seed layer on the first surface of the substrate on at least a region inside of the perimeter trace of the contact electrode;
applying a second added conductive layer on the first surface of the substrate on at least the region inside of the perimeter trace of the contact electrode; and
removing the photoresist from the first surface of the substrate.

20. The method of claim 10 , wherein the contact electrode is configured as a fishbone with an elongated portion and a plurality of transversal fingers.

Assignees

• Biosense Webster Israel Ltd

Inventors

• Beeckler Christopher Thomas
• Keyes Joseph Thomas
• Govari Assaf

Classifications

• A61B2018/00821

  measured by a thermocouple · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• A61B2018/00642

  with feedback, i.e. closed loop control · CPC title

• A61B2018/1405

  Electrodes having a specific shape · CPC title

• A61B2018/0016

  Energy applicators arranged in a two- or three dimensional array · CPC title