Optoelectronic arrangement

Patent metadata

Field	Value
Publication number	US-10651623-B2
Application number	US-201615768049-A
Country	US
Kind code	B2
Filing date	Oct 14, 2016
Priority date	Oct 15, 2015
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

An arrangement includes a conversion element, an optoelectronic semiconductor component and a first carrier including a carrier plane, wherein the conversion element is arranged on the carrier plane, the optoelectronic semiconductor component emits a first electromagnetic radiation including a first beam direction and a first wavelength from a first spectral range during operation, the first electromagnetic radiation is directed onto the conversion element, the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation including a second wavelength from a second spectral range, the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane, a housing including a housing cap is provided, the housing cap is configured in a hollow-body-like fashion, the housing cap and the carrier define an interior, the conversion element and the semi-conductor component are arranged in the interior, and the housing cap includes a coupling-out window that couples out the second electromagnetic radiation.

First claim

The invention claimed is:

1. An arrangement comprising:
a conversion element, an optoelectronic: semiconductor component and a first carrier comprising a carrier plane,
wherein the conversion element is arranged on the carrier plane,
the optoelectronic semiconductor component emits a first electromagnetic radiation comprising a first beam direction and a first wavelength from a first spectral range during operation,
the first electromagnetic radiation is directed onto the conversion element,
the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation comprising a second wavelength from a second spectral range,
the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane,
a housing comprising a housing cap is provided,
the housing cap is configured in a hollow-body-like fashion,
the housing cap and the carrier delimit an interior,
the conversion element and the semiconductor component are arranged in the interior,
the housing cap comprises a coupling-out window that couples out the second electromagnetic radiation,
the first carrier comprises a first carrier top side,
a second carrier comprising a second carrier top side and a carrier underside is provided,
the second carrier connects by the carrier underside to the first carrier top side,
the optoelectronic semiconductor component is arranged on the second carrier top side,
the second carrier top side is arranged at an inclination with respect to the carrier plane,
the optoelectronic semiconductor component comprises an emission face and a longitudinal side,
the optoelectronic semiconductor component is arranged by the longitudinal side on the second carrier top side,
the emission face is a side face of the optoelectronic semiconductor component adjoining the longitudinal side,
the emission face faces the conversion element,
via the emission face, the optoelectronic semiconductor component emits substantially a large portion of the first electromagnetic radiation, and
the first electromagnetic radiation is emitted in direction of the first carrier.

2. The arrangement according to claim 1 , wherein
the conversion element emits the second electromagnetic radiation with an emission direction,
the emission direction of the second electromagnetic radiation is delimited to an effective emission region by a means arranged in a manner offset with respect to the conversion element, and
the optoelectronic semiconductor component is arranged outside the effective emission region.

3. The arrangement according to claim 1 , wherein
a reflection layer is provided,
the reflection layer is arranged between the first carrier and the conversion element, and
the reflection layer reflects the first and/or second electromagnetic radiation at least in a direction facing away from the first carrier.

4. The arrangement according to claim 1 , wherein
the first carrier comprises a recess on a side facing the optoelectronic semiconductor component,
the carrier plane is arranged at a base of the recess, and
the conversion element is at least partly arranged in the recess and the optoelectronic component is arranged outside the recess.

5. The arrangement according to claim 4 , wherein
the recess comprises a base and a recess side face,
the recess is delimited by the base and the recess side face, and
the recess side face adjoins the second carrier top side.

6. The arrangement according to claim 1 , wherein
the first beam direction and the carrier plane form an angle,
the angle comprises a value of 40° to 50°.

7. The arrangement according to claim 1 , wherein
the optoelectronic semiconductor component comprises an emission face and a longitudinal side,
the optoelectronic semiconductor component is arranged by the longitudinal side on the second carrier top side and the emission face is a side face of the optoelectronic semiconductor component which adjoins the longitudinal side,
the emission face is shorter than the longitudinal side,
the optoelectronic semiconductor component emits a large portion of the first electromagnetic radiation via the emission face facing the conversion element.

8. The arrangement according to claim 1 , wherein
a first optical element is arranged between the optoelectronic semiconductor component and the conversion element, and
the first optical element focuses the first electromagnetic radiation onto the conversion element.

9. The arrangement according to claim 1 , wherein
the housing cap comprises a cap edge,
the cap edge connects to the first carrier, and
the coupling-out window is arranged in a manner offset with respect to the cap edge.

10. The arrangement according to claim 1 , wherein the optoelectronic semiconductor component is arranged between the coupling-out window and the first carrier.

11. The arrangement according to claim 1 , further comprising:
a second optical element,
wherein the second optical element connects to the housing cap,
the second optical element alters a beam behavior of the second electromagnetic radiation, and
the second optical element preferably comprises at least one lens.

12. The arrangement according to claim 11 , wherein
the second optical element is arranged between the coupling-out window and the conversion element, and
the optoelectronic semiconductor component is arranged between the conversion element and the second optical element.

13. The arrangement according to claim 1 , further comprising:
a further optoelectronic semiconductor component,
wherein the further optoelectronic semiconductor component provides a third electromagnetic radiation comprising a third wavelength and a third beam direction during operation,
the third electromagnetic radiation is directed onto the conversion element,
the conversion element at least partly converts the first and third electromagnetic radiation into the second electromagnetic radiation, and
the third beam direction is at an inclination with respect to the carrier plane.

14. The arrangement according to claim 13 , wherein the emission direction of the second electromagnetic radiation is guided between the optoelectronic semiconductor component and the further optoelectronic semiconductor component.

15. The arrangement according to claim 1 , wherein the optoelectronic semiconductor component comprises at least one laser chip, at least one LED chip or a combination thereof.

16. The arrangement according to claim 1 , wherein a cap edge of the housing cap directly contacts the first carrier and connects to the first carrier.

17. The arrangement according to claim 1 , wherein the first electromagnetic radiation is not directly coupled out via the coupling-out window.

18. The arrangement according to claim 17 , wherein
the conversion element emits the second electromagnetic radiation with an emission direction,
the emission direction of the second electromagnetic radiation is delimited to an effective emission region by a means arranged in a manner offset with respect to the conversion element, and
the optoelectronic semiconductor component is arranged outside the effective emission region,
a reflection layer is provided,
the reflection layer is arranged between the first carrier and the conversion element, and
the reflection layer reflects the first and/or second electromagnetic radiation at least in a direction facing away from the first carrier.

19. An arrangement compr

Assignees

• Osram Oled Gmbh

Inventors

• Auen Karsten
• Horn Markus
• Enzmann Roland

Classifications

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/02212

  Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis · CPC title

• H01L33/486

  Electricity · mapped topic

• H01S5/02292

  Electricity · mapped topic

• H01L33/505

  Electricity · mapped topic