Bi-directional cable interconnect system
US-10084262-B2 · Sep 25, 2018 · US
US10651606B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10651606-B2 |
| Application number | US-201916240800-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 7, 2019 |
| Priority date | Nov 11, 2017 |
| Publication date | May 12, 2020 |
| Grant date | May 12, 2020 |
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Official abstract text for this publication.
A QSFP-DD receptacle connector received within a cage includes an insulative housing and a contact module assembly received within the housing. The contact module includes a plurality of horizontal wafers stacked with one another, and each wafer includes an insulator and a plurality of contacts integrally formed therein wherein each contact has a front contact sections extending forwardly into a mating cavity formed in the housing, and a rear connecting section connected to a cable rather than to the printed circuit board. The receptacle connector associated with a cable is attached to a chassis. The cage optionally forms therein two mating spaces respectively receiving two receptacle connectors with the associated cables extending rearwardly.
Opening claim text (preview).
What is claimed is: 1. An interconnection system comprising: a metallic cage attached to a chassis and forming a receiving space therein; and a receptacle connector assembly secured to the cage and received in a rear portion of the receiving space, said receptacle connector comprising: an insulative housing; a contact module disposed in the housing and including opposite upper subassembly and lower subassembly assemble stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including an upper wafer and a lower wafer, each of the upper wafer and the lower wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section; and a plurality of cables comprising high speed cables and low speed cables connected with the connecting sections of the high speed contacts and low speed contacts, respectively. 2. The interconnection system as claimed in claim 1 , wherein each of the upper wafer and the lower wafer comprises a front/outer wafer and a rear/inner wafer stacked with each other in the vertical direction. 3. The interconnection system as claimed in claim 2 , wherein the rear connecting sections of the front/outer wafer are located in front of those of the rear/inner wafer in a front-to-back direction perpendicular to said vertical direction, and are respectively offset from those of the rear/inner wafer in a transverse direction perpendicular to both said vertical direction and said front-to-back direction. 4. The interconnection system as claimed in claim 2 , wherein each of the front/outer wafer and the rear/inner wafer, the grounding contacts are unitarily formed with a commonly grounding bar extending in the transverse direction, and a common grounding bracket grasping outer braiding of the corresponding cables are electrically connected with the grounding bar. 5. An electrical connector comprising: an insulative housing; a contact module disposed in the housing and including opposite upper subassembly and lower subassembly stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including a front/outer wafer and a rear/inner wafer stacked with each other in the vertical direction, each of said front/outer wafer and said rear/inner wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section, wherein the rear connecting sections of the front/outer wafer are located in front of those of the rear/inner wafer in a front-to-back direction perpendicular to said vertical direction, and are respectively offset from those of the rear/inner wafer in a transverse direction perpendicular to both said vertical direction and said front-to-back direction. 6. The electrical connector as claimed in claim 5 , further including a plurality of cables having corresponding inner conductors soldered upon the connecting sections of the corresponding contacts, respectively. 7. The electrical connector as claimed in claim 6 , wherein in each of the front/outer wafer and the rear/inner wafer, the grounding contacts are unitarily formed with a commonly grounding bar extending in the transverse direction, and a common grounding bracket grasping outer braiding of the corresponding cables are soldered upon the grounding bar. 8. The electrical connector as claimed in claim 6 , wherein said cables include high speed cables and low speed cables connected to the connecting sections of the corresponding high speed contacts and low speed contacts at different levels. 9. The electrical connector as claimed in claim 8 , wherein in each of the upper subassembly and the lower subassembly, the connecting sections of the corresponding low speed contacts of the front/outer wafer and those of rear/inner wafer are located by two sides of those of both the front/outer wafer and the rear/inner wafer in the vertical direction. 10. The electrical connector as claimed in claim 9 , wherein the connecting sections of the corresponding low speed contacts of the front/outer wafer extend in the vertical direction while those of the rear/inner wafer extend in the front-to-back direction. 11. The electrical connector as claimed in claim 8 , wherein in each of the upper subassembly and the lower sub assembly, the corresponding high speed cables of the front/outer wafer are alternately arranged with those of the rear/inner wafer in the transverse direction. 12. The electrical connector as claimed in claim 5 , wherein the front/outer wafer is equipped with a grounding plate attached upon an outer side thereof to common the corresponding grounding contacts thereof, and the rear/inner wafer is equipped with another grounding plate sandwiched between the front/outer wafer and the rear/inner wafer in the vertical direction to common the corresponding grounding contacts. 13. The electrical connector as claimed in claim 5 , wherein in each of said front/outer wafer and said rear/inner wafer, the corresponding high speed differential pair contacts are located by two sides of the corresponding low speed contacts along the transverse direction. 14. The electrical connector as claimed in claim 5 , wherein the connecting sections of the low speed contacts protrude outside of the corresponding wafers of the contact module while those of the high speed contacts are not. 15. The electrical connector as claimed in claim 5 , wherein the upper subassembly and the lower subassembly are essentially symmetrically arranged with each other in the vertical direction. 16. An electrical connector comprising: an insulative housing; a contact module disposed in the housing and including opposite upper subassembly and lower subassembly stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including a front/outer wafer and a rear/inner wafer stacked with each other in the vertical direction, each of said front/outer wafer and said rear/inner wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section, wherein a plurality of cables including a plurality of high speed cables and a plurality of cables respectively mechanically and electrically connected to the connecting sections of the corresponding high speed differential pair contacts and those of the low speed contacts; wherein the connecting sections of the low speed contacts of the front/outer wafer of the lower subassembly extend downwardly in the vertical direction while those of the upper subassembly extend upwardly in the vertical direction. 17. The electrical connector as claimed in claim 16 , wherein the connecting sections of all contacts, except those of the front/outer wafers, extend rearwardly in a front-to-back direction perpendicular to the vertical direction. 18. The electrical connector as claimed in claim 17 , wherein a bottom side of the housing includes mounting posts extending downwardly in the vertical direction. 19. The electrical connector as claimed in claim 18 , wherein a cap is mounted upon a top side of the housing to shield the contact module in the vertical direction. 20. The electrical connector as claimed in claim 16 , wherein the connecting sections of the low speed contacts protrude outside of th
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