Electronic component, electric device including the same

Patent metadata

Field	Value
Publication number	US-10651260-B2
Application number	US-201815970902-A
Country	US
Kind code	B2
Filing date	May 4, 2018
Priority date	Aug 22, 2017
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

Provided is an electronic device including a display panel including a base substrate, pixels, a first insulation layer, and panel pads spaced along a first direction from pixels and each arranged along a second direction crossing the first direction, a circuit board disposed on the display panel and connected to panel pads, and an adhesive interconnect layer disposed between the display panel and the circuit board and electrically connecting the display panel and the circuit board. The circuit board includes a flexible substrate including a top surface facing the base substrate, output pads disposed on the flexible substrate and connected to panel pads, each obliquely extending in the first and second directions and arranged along the second direction, an alignment pad spaced along the second direction from output pads, and a stress relaxation pad disposed between output pads and alignment pads and electrically connected from panel pads.

First claim

What is claimed is:

1. An electronic device comprising: a display panel including a base substrate, a plurality of pixels disposed on the base substrate, a first insulation layer disposed on the base substrate and including an organic material, and a plurality of panel pads, at least a portion of the plurality of panel pads being partially exposed by the first insulation layer, the plurality of panel pads being spaced apart in a first direction from the pixels, and each of the plurality of panel pads being arranged along a second direction crossing the first direction; a circuit board disposed on the display panel and connected to the plurality of panel pads; and an adhesive interconnect layer disposed between the display panel and the circuit board and electrically connecting the display panel and the circuit board, wherein the circuit board includes: a flexible substrate having a top surface facing the base substrate; a plurality of output pads which are disposed on the flexible substrate and connected to the plurality of panel pads, each of which extends obliquely with respect to the first direction and the second direction, and which are arranged along the second direction; an alignment pad spaced apart along the second direction from the output pads; and a first pad disposed between the output pads and the alignment pad, and electrically insulated from the plurality of panel pads; and wherein the first pad is disposed in a same layer as the output pads and comprises a same material as the output pads.

2. The electronic device of claim 1 , wherein the output pads have predetermined extension angles with respect to the first direction, and at least two pads among the output pads have different extension angles.

3. The electronic device of claim 1 , wherein the first pad is disposed on the same layer as the output pads, and comprises a same material as the output pads.

4. The electronic device of claim 1 , wherein the display panel further comprises a window pad spaced apart from the plurality of panel pads and overlap the first pad in a plan view,
wherein a portion of the first insulation layer overlapping the window pad is removed.

5. The electronic device of claim 1 , wherein each of the pixels comprises a thin film transistor disposed on the base substrate and a pixel electrode connected to the thin film transistor,
the first insulation layer is disposed between the thin film transistor and the pixel electrode, and
the pixel electrode contacts the thin film transistor through a contact hole formed in the first insulation layer.

6. The electronic device of claim 1 , wherein the length of the first pad in the first direction is greater than or equal to the length of the alignment pad in the first direction and is less than or equal to the lengths of the output pads in the first direction.

7. The electronic device of claim 6 , wherein the display panel further comprises an additional alignment pad disposed on the base substrate and spaced apart from the alignment pad in the first direction,
wherein the first pad is spaced apart from the alignment pad, the output pad, and the additional alignment pad in a plan view.

8. The electronic device of claim 1 , wherein
the output pads overlap the plurality of panel pads in a plan view,
the first pad is spaced apart from the plurality of panel pads in a plan view.

9. The electronic device of claim 8 , wherein the adhesive interconnect layer is in contact with the first insulation layer in an area in which the adhesive interconnect layer is superimposed on the first pad.

10. The electronic device of claim 9 , wherein the adhesive interconnect layer comprises:
an adhesive layer; and
a plurality of conductive particles dispersed in the adhesive layer,
the adhesive layer and the first insulation layer being in contact with each other in an area of being superimposed on the first pad.

11. The electronic device of claim 10 , further comprising a second insulation layer disposed between the first insulation layer and the base substrate,
wherein the adhesive force between the first insulation layer and the adhesive layer is greater than the adhesive force between the first insulation layer and the second insulation layer.

12. The electronic device of claim 1 , wherein the first pad comprises a plurality of sub-pads which are spaced apart from each other along the second direction.

13. The electronic device of claim 12 , wherein the sub-pads extend in a direction crossing the output pads.

14. The electronic device of claim 12 , wherein the sub-pads extend in a direction parallel to the output pads.

15. The electronic device of claim 14 , wherein the sub-pads extend in a direction parallel to the output pad closest to the sub-pads among the output pads.

16. An electronic component comprising: a flexible substrate including one side extending along a direction; an electronic element disposed on the flexible substrate; a plurality of output pads disposed adjacent to the one side and spaced apart from the electronic element in a first direction crossing a second direction which the one side extends in, each of the plurality of output pads being spaced apart from each other along the second direction and extending obliquely with respect to each of the first direction and the second direction; an alignment pad spaced apart in the second direction from the output pads; and a first pad disposed between the output pads and the alignment pad, and electrically insulated from the output pads; wherein the first pad is disposed in a same layer as the output pads, and comprises a same material as the output pads.

17. The electronic component of claim 16 , wherein the length of the first pad in the first direction is greater than or equal to the length of the alignment pad in the first direction, and is less than or equal to the lengths of the pads in the first direction.

18. The electronic component of claim 16 , wherein the first pad comprises a plurality of sub-pads extending obliquely with respect to each of the first direction and the second direction, and
the plurality of sub-pads are spaced apart from the output pads and the alignment pad in a plan view.

19. The electronic component of claim 18 , wherein the sub-pads are parallel to at least one of the output pads.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Chung-Seok
• Kim Joonsam
• Jung Chulho

Classifications

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K2201/10128

  Display · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K2201/09781

  Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title