Input device manufacturing method

Patent metadata

Field	Value
Publication number	US-10649604-B2
Application number	US-201916365385-A
Country	US
Kind code	B2
Filing date	Mar 26, 2019
Priority date	Oct 4, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

An input device manufacturing method includes: a first process in which, in a state in which a sensor film is inserted into a die, the sensor film having a detection area and a non-detection area other than the detection area, the detection area and the non-detection area constituting the sensor, as well as a first surface formed into a curved surface and a second surface positioned opposite to the first surface, a material that includes a synthetic resin having a translucent property is poured into the die to form a resin layer on the same side as the second surface; and a second process in which a decorative film having a decorative area that covers the non-detection area is pasted to the first surface with an adhesive layer intervening between the decorative film and the first surface.

First claim

What is claimed is:

1. A method for manufacturing an input device, the method comprising:
providing a sensor film including a detection area which forms a sensor, and a non-detection area surrounding the detection area, the sensor film having a first surface formed into a curved surface and a second surface opposite to the first surface;
inserting the sensor film into a die;
pouring a material that includes a synthetic resin having a translucent property into the die so as to form a resin layer facing the second surface, thereby providing a laminated body of the sensor film and the resin layer, the resin layer being larger than the sensor film and extending beyond an edge of the sensor film such that an edge of the sensor film is embedded in the resin layer, thereby forming a top main surface of the laminated body including the first surface of the sensor film, a bottom surface of the resin layer on an opposite side of the sensor film forming a bottom main surface of the laminated body; and
attaching, after forming the resin layer, a decorative film having a decorative area to the top main surface of the laminated body with an adhesive layer intervening therebetween, such that the decorative area covers the non-detection area of the sensor film,
wherein the sensor film is provided with a lead wire extending from the non-detection area and having a terminal part,
and wherein in the forming of the resin layer, the lead wire extends from the top main surface across the resin layer such that the terminal part is exposed from the bottom main surface of the laminated body.

2. The method according to claim 1 , wherein the decorative film is attached using a three dimension overlay method.

3. The method according to claim 1 , wherein in the forming of the resin layer, the lead wire is buried in the resin layer so as to extend therethrough from the top main surface to the bottom main surface.

4. The method according to claim 3 , wherein, the terminal part is exposed on and along the bottom main surface.

5. The method according to claim 1 , wherein in the forming of the resin layer, the lead wire extends along a side surface of the resin layer such that the terminal part extends beyond the bottom main surface.

Assignees

• Alps Alpine Co Ltd

Inventors

• Hashida Junji

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F2203/04112

  Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F2203/04102

  Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title