Heat pump system and cooling generation method

US10648710B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10648710-B2
Application numberUS-201716078130-A
CountryUS
Kind codeB2
Filing dateMar 3, 2017
Priority dateMar 30, 2016
Publication dateMay 12, 2020
Grant dateMay 12, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat pump system generates cooling by evaporating a refrigerant using an evaporator, and generates cooling by using a compressor to desorb refrigerant that has been evaporated by the evaporator and adsorbed at an adsorption device.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat pump system comprising: an evaporator that cools a cooling target by evaporation of a refrigerant; a compressor that compresses the refrigerant in a gaseous phase; and an adsorption device at which the refrigerant evaporated at the evaporator is adsorbed, and that cools the cooling target by desorption of the refrigerant by movement of the refrigerant toward the compressor, wherein the cooling target flows through at least one of the evaporator or the adsorption device, and heat generated by cooling is expelled in a case in which the cooling target flows through the evaporator. 2. The heat pump system of claim 1 , further comprising: a condenser that condenses the refrigerant compressed by the compressor; and an expander that causes the refrigerant condensed by the condenser to expand and conveys the refrigerant to the evaporator. 3. The heat pump system of claim 1 , wherein a plurality of the adsorption devices are disposed in parallel with respect to a movement direction of the refrigerant, between the evaporator and the compressor. 4. The heat pump system of claim 3 , wherein the cooling target flows through, and is cooled by, the evaporator and an adsorption device, among the plurality of adsorption devices, at which refrigerant is desorbed. 5. The heat pump system of claim 4 , wherein the refrigerant is desorbed using the compressor, from an adsorption device, among the plurality of adsorption devices, that has already adsorbed the refrigerant evaporated at the evaporator. 6. The heat pump system of claim 1 , wherein the adsorption device adsorbs the refrigerant at a saturated vapor pressure of the refrigerant in the evaporator. 7. A cooling generation method comprising: generating cooling by evaporating refrigerant using an evaporator; and generating cooling by desorbing, using a compressor, the refrigerant from an adsorption device that has already adsorbed the refrigerant evaporated at the evaporator, wherein a cooling target flows through at least one of the evaporator or the adsorption device, and heat generated by cooling is expelled in a case in which the cooling target flows through the evaporator. 8. The cooling generation method of claim 7 , further comprising: providing a plurality of the adsorption devices; and while the refrigerant evaporated at the evaporator is being absorbed in at least one of the adsorption devices, using the compressor to desorb the refrigerant from at least another one of the adsorption devices.

Assignees

Inventors

Classifications

  • using absorption or adsorption · CPC title

  • F25B25/02Primary

    Compression-sorption machines, plants, or systems · CPC title

  • Controlling the flow of liquid in a heat pump system (controlling the properties of the refrigerant liquid, e.g. pressure or temperature, B60H1/3204) · CPC title

  • with two or more boiler-sorbers operating alternately · CPC title

  • for increasing the efficiency in a vehicle heat pump · CPC title

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Frequently asked questions

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What does patent US10648710B2 cover?
A heat pump system generates cooling by evaporating a refrigerant using an evaporator, and generates cooling by using a compressor to desorb refrigerant that has been evaporated by the evaporator and adsorbed at an adsorption device.
Who is the assignee on this patent?
Toyota Chuo Kenkyusho Kk
What technology area does this patent fall under?
Primary CPC classification F25B25/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 12 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).