Process kit having a floating shadow ring

Patent metadata

Field	Value
Publication number	US-10648071-B2
Application number	US-201715814696-A
Country	US
Kind code	B2
Filing date	Nov 16, 2017
Priority date	Nov 19, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

First claim

The invention claimed is:

1. A process kit, comprising:
an adapter having an adapter body and a shield portion radially inward of the adapter body;
a heat transfer channel formed in the adapter body;
a shadow ring coupled to the adapter between the adapter body and the shield portion such that the shield portion of the adapter extends over a portion of the shadow ring; and
a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

2. The process kit of claim 1 , wherein the shadow ring comprises a ring body disposed between the adapter body and shield portion and a protruding section extending radially inward from a lower portion of the ring body to a position radially inward of the shield portion.

3. The process kit of claim 2 , wherein the shield portion protrudes downward from the adapter body to cover at least a portion of the ring body.

4. The process kit of claim 2 , wherein shadow ring further comprises a second heat transfer channel formed in the ring body.

5. The process kit of claim 1 , wherein the shadow ring comprises an outer portion coupled to the adapter and an inner portion extending radially inward from the outer portion.

6. The process kit of claim 5 , wherein the shield portion protrudes radially inward from the adapter body to extend over the outer portion and a portion of the inner portion.

7. The process kit of claim 6 , wherein the shadow ring further comprises an upwardly extending protrusion disposed beneath the shield portion to form a tortuous path between the shadow ring and the adapter.

8. The process kit of claim 7 , wherein the shadow ring further comprises a plurality of gas conductance holes formed in the outer portion to allow a gas to flow through the plurality of gas conductance holes.

9. The process kit of claim 1 , wherein the shadow ring is coupled to the adapter via a plurality of bolts extending through the shadow ring, the ceramic insulator, and the adapter.

10. The process kit of claim 1 , wherein at least one of the adapter or the shadow ring is formed of aluminum, stainless steel, or copper.

11. A process chamber, comprising:
a chamber wall defining an inner volume within the process chamber, wherein the chamber wall is grounded;
a sputtering target disposed in an upper section of the inner volume;
a substrate support having a support surface to support a substrate below the sputtering target; and
a process kit, comprising:
an adapter having an adapter body coupled to the chamber wall and a shield portion radially inward of the adapter body;
a heat transfer channel formed in the adapter body;
a shadow ring coupled to the adapter and surrounding the substrate support such that the shield portion of the adapter extends over a portion of the shadow ring; and
a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter, wherein the adapter is disposed on an upper surface of the ceramic insulator.

12. The process chamber of claim 11 , wherein the shadow ring is configured so that a radially innermost portion of the shadow ring is above the substrate by between about 0.02 inches to about 0.09 inches.

13. The process chamber of claim 11 , wherein the shadow ring is configured so that a radially innermost portion of the shadow ring is disposed between about 2 mm within a diameter of the substrate and about 1 mm outside the diameter of the substrate.

14. The process chamber of claim 11 , wherein the shadow ring comprises a ring body and a protruding section extending radially inward from a lower portion of the ring body.

15. The process chamber of claim 14 , wherein the shield portion protrudes downward from the adapter body to cover at least a portion of the ring body.

16. The process chamber of claim 14 , wherein shadow ring further comprises a second heat transfer channel formed in the ring body.

17. The process chamber of claim 11 , wherein the shadow ring comprises an outer portion coupled to the adapter and an inner portion extending radially inward from the outer portion.

18. The process chamber of claim 17 , wherein the shield portion protrudes radially inward from the adapter body to extend over the outer portion and a portion of the inner portion.

19. The process chamber of claim 18 , wherein the shadow ring further comprises an upwardly extending protrusion disposed beneath the shield portion to form a tortuous path between the shadow ring and the adapter, and wherein the shadow ring further comprises a plurality of gas conductance holes formed in the outer portion to allow a gas to flow through the plurality of gas conductance holes.

20. A process kit, comprising:
an electrically conductive adapter having an adapter body and a shield portion radially inward of the adapter body;
a coolant channel formed in the adapter body;
an electrically conductive shadow ring coupled to the adapter;
a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter; and
a deposition ring having an upper surface configured to interface with a lower surface of the shadow ring to form a tortuous path between the deposition ring and the shadow ring, wherein the shield portion extends over a portion of the shadow ring.

Assignees

• Applied Materials Inc

Inventors

• Johanson William
• Hoi Siew Kit
• Mazzocco John
• Savandaiah Kirankumar
• Prabhu Prashant

Classifications

• H01J37/3488

  Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus · CPC title

• C23C14/34 Primary

  Sputtering · CPC title

• H01J37/32477

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C23C14/50

  Substrate holders · CPC title