Interlayer filler material for touch panels, and touch panel laminate

US10647895B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10647895-B2
Application numberUS-201615764983-A
CountryUS
Kind codeB2
Filing dateOct 6, 2016
Priority dateOct 7, 2015
Publication dateMay 12, 2020
Grant dateMay 12, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, is less likely to cause cracks or breakage in a surface protection panel or a glass substrate, and enables production of a touch panel laminate that is not likely to display images with color irregularity. The present invention also aims to provide a touch panel laminate produced using the interlayer filling material for a touch panel. The present invention relates to an interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component, or at least one of interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film, the interlayer filling material containing: a polyvinyl acetal; and a plasticizer, the interlayer filling material having a residual stress Kpa (25° C., 2 min) after two minutes at 25° C. of 300 kPa or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. An interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component, or at least one of interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film, the interlayer filling material comprising: a polyvinyl acetal; and a plasticizer, the interlayer filling material having a residual stress Kpa (25° C., 2 min) after two minutes at 25° C. of 300 kPa or less as measured in conformity with JIS K 6263:2004. 2. The interlayer filling material for a touch panel according to claim 1 , wherein a stress relaxation rate after two minutes at 25° C. is 75% or higher, wherein the stress relaxation rate after two minutes at 25° C. is a value in percentage obtained by dividing stress after two minutes by maximum stress and then subtracting the resulting value from 1. 3. The interlayer filling material for a touch panel according to claim 1 , wherein the polyvinyl acetal is polyvinyl butyral. 4. The interlayer filling material for a touch panel according to claim 1 , wherein the polyvinyl acetal has an average degree of polymerization of 2,000 or less. 5. The interlayer filling material for a touch panel according to claim 1 , wherein the amount of the plasticizer relative to 100 parts by weight of the polyvinyl acetal is 10 to 75 parts by weight. 6. The interlayer filling material for a touch panel according to claim 1 , further comprising: a reactive diluent; and a photopolymerization initiator. 7. The interlayer filling material for a touch panel according to claim 6 , wherein the reactive diluent is a (meth)acrylic reactive diluent, an epoxy reactive diluent, or a silicone reactive diluent. 8. The interlayer filling material for a touch panel according to claim 6 , wherein the amount of the reactive diluent relative to 100 parts by weight of the polyvinyl acetal is 0.1 to 30 parts by weight. 9. A touch panel laminate comprising: a touch panel; and the interlayer filling material for a touch panel according to claim 1 , the interlayer filling material for a touch panel filling at least one interlayer space selected from the group consisting of an interlayer space between a surface protection panel and the touch panel, an interlayer space between the touch panel and a polarizing film, and interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film.

Assignees

Inventors

Classifications

  • Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • C09J129/14Primary

    Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols · CPC title

  • organic · CPC title

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence) · CPC title

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Frequently asked questions

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What does patent US10647895B2 cover?
The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, is less likely to cause cracks or breakage in a surface protection panel or a glass s…
Who is the assignee on this patent?
Sekisui Chemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C09J129/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 12 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).