Adhesive and structure, and adhesion method

Patent metadata

Field	Value
Publication number	US-10647892-B2
Application number	US-201615548655-A
Country	US
Kind code	B2
Filing date	Feb 9, 2016
Priority date	Feb 9, 2015
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.

First claim

The invention claimed is:

1. An adhesive for bonding between a first member containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin, the adhesive comprising:
a thermoplastic resin containing a metal nano material that absorbs electromagnetic waves and generates heat,
wherein the nano material is nanocoils.

2. The adhesive according to claim 1 , wherein a frequency of the electromagnetic waves is 3 MHz or more and 3 GHz or less.

3. The adhesive according to claim 1 , wherein the metal is platinum or gold.

4. The adhesive according to claim 1 , wherein the adhesive is in a sheet form, and the amount of the nano material added to the thermoplastic resin is 30 μg/cm 2 or less.

5. A structure comprising the first member and the second member bonded to each other with the adhesive according to claim 1 .

6. The structure according to claim 5 , wherein the thermoplastic resin in the adhesive and the thermoplastic resin in at least one of the first member and the second member are the same material.

7. An adhesion method comprising the steps of:
placing the adhesive according to claim 1 in a portion of the first member to be bonded;
placing the second member on the adhesive; and
irradiating the adhesive with the electromagnetic waves to bond the first member and the second member with the adhesive.

Assignees

• Mitsubishi Heavy Ind Ltd
• Univ Akita
• Tsuchiya Kk

Inventors

• Takayanagi Toshiyuki
• Ishikawa Naomoto
• Horizono Hideki
• Kamihara Nobuyuki
• Muraoka Mikio
• Hayashi Hiroaki
• Yoshida Osamu
• Tsuji Kotaro

Classifications

• C08K2003/0831

  Gold · CPC title

• C09J7/10

  without carriers · CPC title

• B29C66/1122

  Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

• B29C65/489

  being metals · CPC title

• C08K3/08

  Metals · CPC title