Coated building panels and articles containing calcium sulfate hemihydrate
US-2016355438-A1 · Dec 8, 2016 · US
US10647859B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10647859-B2 |
| Application number | US-201716302214-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2017 |
| Priority date | May 31, 2016 |
| Publication date | May 12, 2020 |
| Grant date | May 12, 2020 |
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Official abstract text for this publication.
The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: —castor oil as resin component; and —a further resin component having a hydroxyl number in the range of from 00 to 800 mg KOH/g, wherein the curing component comprises a polyisocyanate, and wherein the two-component putty further comprises hollow microspheres and an organically modified inorganic filler. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method.
Opening claim text (preview).
The invention claimed is: 1. A two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: castor oil as resin component; and a further resin component having a hydroxyl number in the range of from 500 to 800 mg KOH/g, wherein the curing component comprises a polyisocyanate, and wherein the two-component putty further comprises hollow microspheres and an organically modified inorganic filler, wherein the putty comprises 15 to 50 wt % castor oil as resin component; 2 to 25 wt % of the further resin component; 20 to 60 wt % polyisocyanate; 0.5 to 5.0 wt % hollow microspheres; and 5 to 30 wt % organically modified inorganic filler, based on the total weight of the putty. 2. The two-component putty according to claim 1 , wherein the further resin component has an OH number in the range of from 600 to 800 mg KOH/g. 3. The two-component putty according to claim 1 , wherein the polyisocyanate is an aliphatic polyisocyanate containing a biuret group. 4. The two-component putty according to claim 1 , wherein the organically modified inorganic filler is organically modified calcium carbonate. 5. The two-component putty according to claim 1 , wherein the organically modified inorganic filler is an inorganic filler modified with fatty acids. 6. The two-component putty according to claim 1 , wherein the hollow microspheres are organic hollow microspheres. 7. The two-component putty according to claim 1 , wherein the viscosity of the putty as measured by rotary viscometer at a shearing rate of 1 s −1 and at a temperature of 23° C., 30 seconds after having combined and mixed the base component and the curing component, is in the range of from 20,000 to 250,000 mPa·s. 8. A method for coating a substrate, comprising: applying a two-component putty according to claim 1 to a substrate; and allowing the applied putty to cure. 9. The method according to claim 8 , wherein the putty is applied directly to the substrate. 10. The method according to claim 8 , wherein the substrate is a plastic substrate. 11. A coated substrate obtainable by a method according to claim 8 . 12. The two-component putty according to claim 1 wherein the hollow microspheres are polymeric hollow microspheres. 13. The two-component putty according to claim 7 wherein wherein the viscosity of the putty as measured by rotary viscometer at a shearing rate of 1 s −1 and at a temperature of 23° C., 30 seconds after having combined and mixed the base component and the curing component, is in the range of from 30,000 to 200,000 mPa·s. 14. The two-component putty according to claim 7 wherein wherein the viscosity of the putty as measured by rotary viscometer at a shearing rate of 1 s −1 and at a temperature of 23° C., 30 seconds after having combined and mixed the base component and the curing component, is in the range of from 40,000 to 150,000 mPa·s. 15. The method according to claim 8 wherein the applied putty is allowed to cure at a temperature of at most 80° C. 16. The method according to claim 8 wherein the applied putty is allowed to cure at a temperature in the range of from 15° C. to 60° C. 17. The method according to claim 8 wherein the substrate is an epoxy resin based plastic substrate. 18. The method according to claim 8 wherein the substrate is a fiber-reinforced epoxy resin-based plastic substrate.
Filling pastes (materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12) · CPC title
Compositions of oils, fats or waxes; Compositions of derivatives thereof · CPC title
modified by treatment with other compounds · CPC title
Calcium, strontium or barium carbonate · CPC title
characterised by shape, e.g. fibres, flakes or microspheres · CPC title
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