Thermoplastic compositions for electronics or telecommunication applications and shaped article therefore

Patent metadata

Field	Value
Publication number	US-10647840-B2
Application number	US-201716300991-A
Country	US
Kind code	B2
Filing date	May 25, 2017
Priority date	May 26, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.

First claim

That which is claimed is:

1. A thermoplastic composition comprising:
from about 50 wt. % to about 90 wt. % of a polymeric base resin comprising a polypropylene, a poly(p-phenylene oxide), a polycarbonate, a polyetherimide, a polystyrene, a polyphenylene sulfide, or a combination thereof; and
from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (DO glass fiber component,
wherein the low Dk/low Df glass fiber component has a Dk of 4.6 or less at a frequency of about 1 MHz to 1 GHz and a Df of less than about 0.001 at a frequency of from 1 MHz to 1 GHz, and wherein the thermoplastic composition further comprises 0.01 to 20 wt. % of an impact modifier.

2. The thermoplastic composition according to claim 1 , wherein the impact modifier is a styrene and ethylene/butylene (SEBS) copolymer, a polyester ether elastomer/ethylene-ethylacrylate copolymer, or a combination thereof.

3. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises a Dk that is at least 0.1 lower than a substantially identical reference composition in the absence of a low Dk/low Df glass fiber component.

4. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises a Dk that is at least about 3% lower than a substantially identical reference composition in the absence of a low Dk/low Df glass fiber component.

5. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises a Dk that is about 3% to about 12% lower than a substantially identical reference composition in the absence of a low Dk/low Df glass fiber component.

6. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises a Df that is at least about 5% lower than a substantially identical reference composition in the absence of a low Dk/low Df glass fiber component.

7. The thermoplastic composition according to claim 1 , wherein the polymeric base resin comprises polypropylene, poly(p-phenylene oxide), or a combination thereof and the thermoplastic composition comprises a Df that is at least about 30% lower than a substantially identical reference composition in the absence of a low Dk/low Df glass fiber component.

8. The thermoplastic composition according to claim 1 , wherein the composition comprises from about 60 wt. % to about 80 wt. % of the polymeric base resin and from about 20 wt. % to about 30 wt. % of the low Dk/low Df glass fiber component.

9. A method for making a thermoplastic article, comprising: forming a blend by mixing:
from about 50 wt.% to about 90 wt. % of a polymeric base resin comprising a polypropylene, a poly(p-phenylene oxide), a polycarbonate, a polyetherimide, a polystyrene, a polyphenylene sulfide, or a combination thereof; and
from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component, wherein the low Dk/low Df glass fiber component has a Dk of less than about 4.6 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.001 at a frequency of from 1 MHz to 1 GHz, and 0.01 wt. % to 20 wt. % of an impact modifier, and
injection molding, extruding, rotational molding, blow molding or thermoforming the blend to form the thermoplastic article.

10. The method according to claim 9 , wherein the thermoplastic article comprises an antenna or antenna component or a radio frequency component.

11. The method according to claim 9 , wherein the impact modifier is a styrene and ethylene/butylene (SEBS) copolymer, a polyester ether elastomer/ethylene-ethylacrylate copolymer, or a combination thereof.

12. The method according to claim 9 , wherein the thermoplastic article comprises a Dk that is at least about 0.1 lower than a substantially identical reference article in the absence of a low Dk/low Df glass fiber component.

13. The method according to claim 9 , wherein the thermoplastic article comprises a Dk that is at least about 3% lower than a substantially identical reference article in the absence of a low Dk/low Df glass fiber component.

14. The method according to claim 9 , wherein the polymeric base resin comprises polypropylene, poly(p-phenylene oxide), polycarbonate, or a combination thereof and the thermoplastic article comprises a Df that is at least about 5% lower than a substantially identical reference article in the absence of a low Dk/low Df glass fiber component.

15. The method according to claim 9 , wherein the polymeric base resin comprises polypropylene, poly(p-phenylene oxide), or a combination thereof and the thermoplastic article comprises a Df that is at least about 30% lower than a substantially identical reference article in the absence of a low Dk/low Df glass fiber component.

16. The method according to claim 9 , wherein the blend comprises from about 60 wt. % to about 80 wt. % of the polymeric base resin and from about 20 wt. % to about 30 wt. % of the low Dk/low Df glass fiber component.

Assignees

• Sabic Global Technologies Bv

Inventors

• Wang Jian
• Song Shijie
• Wei Zhenke
• Wang Qin
• Dai Mian

Classifications

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08L69/00

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title

• C08L2203/30

  used for thermoforming · CPC title

• C08L23/0869

  with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters · CPC title

• C08L25/04

  Homopolymers or copolymers of styrene · CPC title