Microfluidic system with single drive signal for multiple nozzles

Patent metadata

Field	Value
Publication number	US-10646892-B2
Application number	US-201715803630-A
Country	US
Kind code	B2
Filing date	Nov 3, 2017
Priority date	Jun 20, 2014
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

First claim

The invention claimed is:

1. A method, comprising:
forming a microfluidic die, the forming of the die including:
forming a plurality of fluid ejection groups on a substrate, the forming the plurality of fluid ejection groups including:
forming a plurality of chambers;
forming a plurality of nozzles aligned with the chambers;
forming a plurality of heaters aligned with the plurality of chambers and the plurality of nozzles;

coupling a first electrical trace of a plurality of electrical traces to at least two of the plurality of heaters and a second electrical trace of the plurality of electrical traces to each of the plurality of heaters;
coupling the first electrical trace to a first contact pad on the microfluidic die; and
coupling the second electrical trace to a second contact pad on the microfluidic die.

2. The method of claim 1 , further comprising:
coupling the microfluidic die to a circuit board; and
coupling the first contact pad of the die to a contact on the circuit board.

3. The method of claim 1 , further comprising forming the first electrical trace on a first metal level, and forming the second electrical trace on a second metal level.

4. The method of claim 1 , further comprising:
forming an inlet path through the microfluidic die; and
forming a channel in fluid communication with the inlet path and extending between adjacent chambers of the plurality of chambers.

5. The method of claim 4 , further comprising forming the second electrical trace between the inlet path and the chambers.

6. A microfluidic component, comprising:
a circuit board; and
a microfluidic die on the circuit board, the microfluidic die including:
a substrate;
a plurality of heaters on the substrate;
a number of signal lines, a first one of the number of signal lines coupled to at least two of the plurality of heaters and a second one of the number of signal lines coupled to each of the plurality of heaters; and
a number of contact pads, the first one of the number of signal lines coupled to a first one of the number of contact pads and the second one of the number of signal lines coupled to a second one of the number of contact pads.

7. The microfluidic component of claim 6 wherein the substrate further comprises a first metal level, the number of signal lines being on the first metal level, and the plurality of heaters being on the first metal level.

8. The microfluidic component of claim 6 wherein the circuit board includes:
a first plurality of contact pads on the circuit board;
a second plurality of contact pads on the circuit board; and
a plurality of electrical traces coupled between the first plurality of contact pads and the second plurality of contact pads, each of the second plurality of contact pads on the circuit board coupled at least two of the first plurality of contact pads on the circuit board.

9. The microfluidic component of claim 8 wherein the first plurality of contact pads of the circuit board are coupled to the number of contact pads of the microfluidic die.

10. The microfluidic component of claim 6 wherein the microfluidic die includes:
an inlet path through the microfluidic die;
a plurality of chambers associated with the plurality of heater; and
a channel in fluid communication with the inlet path and extending between adjacent ones of the plurality of chambers.

11. The microfluidic component of claim 10 wherein the circuit board includes an opening through the circuit board, the opening being aligned with the inlet path through the microfluidic die.

12. The microfluidic component of claim 6 wherein the microfluidic die further comprises:
a plurality of fluid ejection groups, each fluid ejection group being aligned with a respective heater of the plurality of heaters.

13. A microfluidic component, comprising:
a microfluidic die that includes:
a substrate;
a plurality of fluid ejection groups on the substrate, the plurality of fluid ejection groups including a plurality of chambers, a plurality of nozzles aligned with the plurality of chambers, and a plurality of heaters;
a plurality of electrical traces, a first one of the plurality of electrical traces coupled to at least two of the plurality of heaters and a second one of the plurality of electrical traces coupled to each of the plurality of heaters;
a first contact pad on the substrate, the first one of the plurality of electrical traces coupled to the first contact pad; and
a second contact pad on the substrate, the second one of the plurality of electrical traces coupled to the second contact pad.

14. The microfluidic component of claim 13 wherein the substrate includes a first metal level, the first one of the plurality of electrical traces and the second one of the plurality of electrical traces being on the first metal level.

15. The microfluidic component of claim 13 , further comprising:
an inlet path extending through the substrate; and
a channel between pairs of chambers of the plurality of chambers and in fluid communication with the inlet path.

16. The microfluidic component of claim 15 wherein at least one of the first one and the second one of the plurality of electrical traces is between the inlet path and the plurality of chambers.

17. The microfluidic component of claim 13 wherein the plurality of heaters are aligned with the plurality of chambers and the plurality of nozzles.

Assignees

• St Microelectronics Inc
• St Microelectronics Srl
• St Microelectronics Int Nv

Inventors

• Dodd Simon
• Scheffelin Joe
• Hunt Dave
• Giere Matt
• Gruenbacher Dana
• Sherman Faiz

Classifications

• B41J2/17526

  Electrical contacts to the cartridge · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title

• B41J2/1601

  Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence) · CPC title

• B41J2/14016

  Structure of bubble jet print heads · CPC title

• B05B17/0638

  spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices · CPC title