Etched planarized VCSEL

Patent metadata

Field	Value
Publication number	US-10644482-B2
Application number	US-201916351214-A
Country	US
Kind code	B2
Filing date	Mar 12, 2019
Priority date	Aug 8, 2016
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

An etched planarized VCSEL includes: an active region; a blocking region over the active region, and defining apertures therein; and conductive channel cores in the apertures, wherein the conductive channel cores and blocking region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region.

First claim

The invention claimed is:

1. A vertical cavity surface emitting laser (VCSEL) array comprising:
an active region;
a blocking region disposed above the active region and including a plurality of laterally arranged apertures, wherein the blocking region includes a first material having a first refractive index and being devoid of oxidation;
a plurality of conductive channel cores in the plurality of laterally arranged apertures, wherein each conductive channel core includes a second material having a second refractive index and being devoid of oxidation, wherein the first refractive index is less than the second refractive index;
a bottom mirror region disposed below the active region;
a top mirror region disposed above the conductive channel cores; and
a light emitting surface associated with the plurality of conductive channel cores; and
wherein the plurality of conductive channel cores, the top mirror region, and the light emitting surface are planarized.

2. The VCSEL array of claim 1 , wherein the VCSEL array is devoid of a mesa structure.

3. The VCSEL array of claim 1 , wherein the plurality of conductive channel cores and the blocking region form an isolation region.

4. The VCSEL array of claim 1 , wherein the bottom mirror region is disposed below the plurality of conductive channel cores.

5. The VCSEL array of claim 1 , wherein the blocking region comprises a thickness from 1 nm to 500 nm and at least one of the conductive channel cores comprises a diameter of about 1 micron to about 10 microns.

6. The VCSEL array of claim 1 , wherein the VCSEL array is devoid of an oxide aperture or oxidation.

7. The VCSEL array of claim 1 , further comprising a conductive wing layer that extends between and connects the plurality of conductive channel cores.

8. The VCSEL of claim 1 , wherein the conductive channel cores are separated from each other by about 1 micron to 10 microns.

9. A method of making a VCSEL array, comprising:
forming an active region over a substrate;
forming a blocking region over the active region, wherein the blocking region includes a first material having a first refractive index and being devoid of oxidation;
etching a plurality of apertures in the blocking region; and
forming a plurality of conductive channel cores in the plurality of apertures of the blocking region, wherein each conductive channel core includes a second material having a second refractive index and being devoid of oxidation, wherein the first refractive index is less than the second refractive index;
forming a top mirror region above the conductive channel cores; and
planarizing the plurality of conductive channel cores, the top mirror region, and a light emitting surface.

10. The method of claim 9 , further comprising:
coating a top of the blocking region with a chemical agent that inhibits etching while leaving a plurality of regions without the chemical agent; and
etching the plurality of the apertures in the blocking region in the plurality of regions without the chemical agent.

11. The method of claim 10 , further comprising filling the plurality of the apertures in the blocking region with the plurality of conductive channel cores by MOCVD.

12. The method of claim 10 , further comprising removing the chemical agent that inhibits the etching after the etching to form the plurality of apertures and before the filling of the plurality of apertures with the plurality of conductive channel cores.

13. The method of claim 9 , further comprising forming the conductive channel core to extend through the blocking region and contact the active region or contact a top spacer region that is above the active region.

14. The method of claim 9 , further comprising forming a conductive wing layer that extends between and connects the plurality of conductive channel cores.

15. An etched planarized vertical cavity surface emitting laser (VCSEL) array comprising:
an active region;
a conductive region above the active region and defining a plurality of apertures, wherein the conductive region includes a second material having a second refractive index and being devoid of oxidation;
a plurality of blocking cores in the apertures of the conductive region, wherein each blocking core includes a first material having a first refractive index and being devoid of oxidation, wherein the first refractive index is less than the second refractive index;
a bottom mirror region below the active region; and
a top mirror region above the conductive region;
wherein the conductive region, plurality of blocking cores, the top mirror region, and light emitting surface are planarized.

16. The VCSEL array of claim 15 , wherein the VCSEL array is devoid of a mesa.

17. The VCSEL array of claim 15 , wherein the blocking region is InGaP and the conductive channel cores are AlGaAs.

18. The VCSEL array of claim 15 , wherein each conductive channel core has a center point, and a distance between each center point is about 2 microns to about 6 microns.

19. A method of making the VCSEL of claim 15 , comprising:
forming the active region over a substrate;
forming the conductive region over the active region, wherein the conductive region includes a second material having a second refractive index and being devoid of oxidation;
etching the plurality of apertures in the conductive region; and
forming the plurality of blocking cores in the plurality of apertures of the conductive region, wherein each blocking core includes a first material having a first refractive index and being devoid of oxidation, wherein the first refractive index is less than the second refractive index.

Assignees

• Finisar Corp

Inventors

• Graham Luke
• MacInnes Andy

Classifications

• H01S5/423 Primary

  having a vertical cavity · CPC title

• H01S5/18322

  Position of the structure · CPC title

• H01S5/18394

  Apertures, e.g. defined by the shape of the upper electrode · CPC title

• H01S5/18341

  Intra-cavity contacts · CPC title

• H01S5/1053

  Comprising an active region having a varying composition or cross-section in a specific direction · CPC title