Antenna for generating arbitrarily directed Bessel beam

US10644398B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10644398-B2
Application numberUS-201815959305-A
CountryUS
Kind codeB2
Filing dateApr 23, 2018
Priority dateJul 28, 2017
Publication dateMay 5, 2020
Grant dateMay 5, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and, a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is entirely divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit consists of printed circuit upper, middle and lower metal patches of which centers are on the same longitudinal axis, the high-frequency dielectric substrate lower layer and the high-frequency dielectric substrate upper layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. An antenna for generating an arbitrarily directed Bessel beam, comprising: a beam-forming plane and a feeding horn; wherein, the feeding horn faces a center of the beam-forming plane; the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function; the beam-forming plane comprises a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit is comprised of a printed circuit upper metal patch, a printed circuit middle metal patch, a printed circuit lower metal patch, the high-frequency dielectric substrate lower layer and the high-frequency dielectric substrate upper layer; centers of the printed circuit upper metal patch, the printed circuit middle metal patch, and the printed circuit lower metal patch are on a same longitudinal axis; the beam-forming unit is a basic unit having a function of electromagnetic wave phase shifting. 2. The antenna for generating an arbitrarily-directed Bessel beam according to claim 1 , wherein an ideal phase shift amount φ(f) of the beam-forming unit on the beam-forming plane is calculated by formulas (1) to (4): φ 1 ⁡ ( f ) = 2 ⁢ π ⁢ f c ⁡ [ d 2 + r 2 - d + ( - r ) × ( l ⁢ ⁢ cos ⁢ ⁢ θ - R ) l 2 + R 2 - 2 ⁢ lR ⁢ ⁢ cos ⁢ ⁢ θ ] ( 1 ) r s = l ⁢ ⁢ cos ⁢ ⁢ θ R ⁢ r ( 2 ) φ 2 ⁡ ( f ) = 2 ⁢ π ⁢ f c ⁡ [ (

Assignees

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Classifications

  • for varying the relative position of primary active element and a refracting or diffracting device · CPC title

  • H01Q15/02Primary

    Refracting or diffracting devices, e.g. lens, prism · CPC title

  • Waveguide horns · CPC title

  • formed of solid dielectric material · CPC title

  • using refracting or diffracting devices, e.g. lens {(radome H01Q1/42)} · CPC title

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What does patent US10644398B2 cover?
An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and…
Who is the assignee on this patent?
Univ Electronic Sci & Tech China
What technology area does this patent fall under?
Primary CPC classification H01Q15/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 05 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).