Packaging material for electrochemical cells

US10644271B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10644271-B1
Application numberUS-201816017927-A
CountryUS
Kind codeB1
Filing dateJun 25, 2018
Priority dateJan 8, 2013
Publication dateMay 5, 2020
Grant dateMay 5, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The described invention relates to the use of parylene and composites of parylene as a flexible, sealable, and near hermetic barrier packaging material for nonaqueous electrochemical cells. Additionally, the invention relates to the technique of sealing of battery packaging material through the use of ultrasonic energy, and to the use of a low melting temperature inorganic barrier, which is predisposed between higher melting temperature polymer layers, that can be sealed to form a truly hermetic barrier at the interface.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: obtaining an electrochemical cell; forming a first sheet of packaging material; wherein the first sheet of packaging material comprises a first layer of para-xylylene polymer; forming a second sheet of packaging material; wherein the second sheet of packaging material comprises a second layer of para-xylylene polymer; bonding the first layer of para-xylylene polymer of the first sheet to the second layer of para-xylylene polymer of the second sheet using ultrasonic energy to form a bonded sheet; bonding the first layer of para-xylylene polymer to a third layer of first metal to form the first sheet of packaging material; bonding the second layer of para-xylylene polymer to a fourth layer of second metal to form the second sheet of packaging material; forming a free-standing package using the bonded sheet; encapsulating the electrochemical cell in the free-standing package; wherein the electrochemical cell comprises an anode, a cathode, and an electrolyte in contact with the anode and the cathode, wherein the first layer of para-xylylene polymer and the second layer of para-xylylene polymer are in contact with the electrolyte. 2. The method of claim 1 , wherein the forming the free-standing package step and the encapsulating step are conducted concomitantly. 3. The method of claim 1 , wherein at least one of the first metal and the second metal comprises at least one of aluminum, copper, bismuth, lead, tin, gallium, or indium. 4. The method of claim 3 , further comprising bonding the third layer of the first metal and the fourth layer of the second metal to form a hermetic seal. 5. The method of claim 4 , wherein the step of bonding the third layer of the first metal and the fourth layer of the second metal is conducted using at least one of thermal energy, ultrasonic energy, or laser energy. 6. The method of claim 1 , wherein the electrochemical cell comprises current collecting tabs, wherein the current collecting tabs extend from an interior space of the free-standing package to an environment outside of the free-standing package between the first sheet of packaging material and the second sheet of packaging material. 7. The method of claim 1 , wherein at least one of the first sheet of packaging material or the second sheet of packaging material comprises a plurality of alternating layers of para-xylylene polymer and metal. 8. A method comprising: forming a first sheet of packaging material; wherein the first sheet of packaging material comprises a first layer of para-xylylene polymer; forming a second sheet of packaging material; wherein the second sheet of packaging material comprises a second layer of para-xylylene polymer; bonding the first layer of para-xylylene polymer of the first sheet to the second layer of para-xylylene polymer of the second sheet using ultrasonic energy to form a bonded sheet; bonding the first layer of para-xylylene polymer to a third layer of first metal to form the first sheet of packaging material; bonding the second layer of para-xylylene polymer to a fourth layer of second metal to form the second sheet of packaging material; forming a free-standing package using the bonded sheet, wherein the free-standing package is configured to encapsulate an electrochemical cell comprising an anode, a cathode, and an electrolyte in contact with the anode and the cathode, wherein the first layer of para-xylylene polymer and the second layer of para-xylylene polymer are in contact with the electrolyte. 9. The method of claim 8 , wherein at least one of the first metal and the second metal comprises at least one of aluminum, copper, bismuth, lead, tin, gallium, or indium. 10. The method of claim 9 , further comprising bonding the third layer of the first metal and the fourth layer of the second metal to form a hermetic seal. 11. The method of claim 10 , wherein the step of bonding the third layer of the first metal and the fourth layer of the second metal is conducted using at least one of thermal energy, ultrasonic energy, or laser energy. 12. The method of claim 8 , wherein at least one of the first sheet of packaging material or the second sheet of packaging material comprises a plurality of alternating layers of para-xylylene polymer and metal.

Assignees

Inventors

Classifications

  • H01M2/0287Primary

    Electricity · mapped topic

  • comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title

  • Batteries · CPC title

  • Packaging equipment or accessories not otherwise provided for · CPC title

  • Dimensional properties · CPC title

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Frequently asked questions

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What does patent US10644271B1 cover?
The described invention relates to the use of parylene and composites of parylene as a flexible, sealable, and near hermetic barrier packaging material for nonaqueous electrochemical cells. Additionally, the invention relates to the technique of sealing of battery packaging material through the use of ultrasonic energy, and to the use of a low melting temperature inorganic barrier, which is pre…
Who is the assignee on this patent?
Univ Rutgers
What technology area does this patent fall under?
Primary CPC classification H01M2/0287. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 05 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).