Semiconductor package separating device

Patent metadata

Field	Value
Publication number	US-10644191-B2
Application number	US-201815980267-A
Country	US
Kind code	B2
Filing date	May 15, 2018
Priority date	Oct 30, 2017
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.

First claim

What is claimed is:

1. A semiconductor package separating device comprising:
a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and
a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a protruding portion and a groove portion that are provided on an outer circumferential surface of the cylindrical punch along the rotational direction, the protruding portion comprising a bending protrusion configured to apply pressure to the fixing portion to bend the fixing portion, and the groove portion comprising a package separating protrusion configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion,
wherein the bending protrusion is one of a plurality of bending protrusions sequentially formed on the protruding portion along the rotational direction, and
wherein the package separating protrusion is one of a plurality of package separating protrusions sequentially formed on the groove portion along the rotational direction.

2. The semiconductor package separating device of claim 1 , wherein the die includes a guide groove provided on an upper surface of the die and configured to guide bending of the fixing portion by the bending protrusion.

3. The semiconductor package separating device of claim 2 , wherein the guide groove is provided a position corresponding to the bending protrusion, and the bending protrusion is bent toward the guide groove.

4. The semiconductor package separating device of claim 1 , further comprising a driver configured to move the cylindrical punch with respect to the lead frame array.

5. The semiconductor package separating device of claim 1 , wherein the protruding portion and the groove portion are provided adjacent to each other on the outer circumferential surface of the cylindrical punch.

6. The semiconductor package separating device of claim 5 , wherein the bending protrusion is provided on the protruding portion, and the package separating protrusion is provided on the groove portion.

7. The semiconductor package separating device of claim 5 , wherein the protruding portion comprises a plurality of protruding portions,
the groove portion comprises a plurality of groove portions, and
the plurality of protruding portions and the plurality of groove portions are alternately provided on the outer circumferential surface of the cylindrical punch along the rotational direction.

8. The semiconductor package separating device of claim 7 , wherein each of the plurality of groove portions is provided between two of the plurality of protruding portions.

9. The semiconductor package separating device of claim 5 , wherein
the plurality of bending protrusions are spaced apart from each other by a predetermined interval in the rotational direction.

10. The semiconductor package separating device of claim 5 , wherein
the plurality of package separating protrusions are provided on a lower surface of the groove portion and spaced apart from each other by a predetermined interval in the rotational direction.

11. The semiconductor package separating device of claim 5 , wherein the bending protrusion and the package separating protrusion are offset from each at a predetermined angle with respect to a central axis of the cylindrical punch.

12. A semiconductor package separating device comprising:
a die configured to support a lead frame array including a plurality of fixing portions, each of the plurality of fixing portions being inserted into an insertion groove formed on at least a side surface of each of a plurality of semiconductor packages to support the plurality of semiconductor packages, the plurality of semiconductor packages being sequentially arranged in a direction; and
a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a plurality of bending protrusions and a plurality of package separating protrusions that are disposed on an outer circumferential surface of the cylindrical punch, each of the plurality of bending protrusions being configured to apply pressure to a fixing portion from among the plurality of fixing portions to bend the fixing portion, and each of the plurality of package separating protrusions being configured to apply pressure to a semiconductor package from among the plurality of semiconductor packages to separate the semiconductor package from the lead frame array in a state in which the fixing portion corresponding to the semiconductor package has been bent,
wherein each of the plurality of bending protrusions is sequentially formed on along the rotational direction, and
wherein each of the plurality of package separating protrusions is sequentially formed along the rotational direction.

13. The semiconductor package separating device of claim 12 , wherein the die includes a plurality of guide grooves provided on an upper surface of the die and configured to guide bending of the plurality of fixing portions by the plurality of bending protrusions.

14. The semiconductor package separating device of claim 12 , wherein the die includes a plurality of guide grooves provided at positions corresponding to the plurality of bending protrusions, and the plurality of bending protrusions are bent toward the plurality of guide grooves.

15. The semiconductor package separating device of claim 12 , wherein a plurality of through-holes are formed in the lead frame array, each of the plurality of through-holes being configured to individually accommodate the plurality of semiconductor packages, the plurality of through-holes being spaced apart from each other in the direction, and
wherein the plurality of fixing portions protrude from opposing side surfaces of the plurality of through-holes.

16. The semiconductor package separating device of claim 12 , wherein the plurality of bending protrusions are configured to bend the plurality of fixing portions.

17. A semiconductor package separating device comprising:
a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of each of a plurality of semiconductor packages to support the plurality of semiconductor packages the plurality of semiconductor packages being sequentially arranged in a direction;
a cylindrical punch configured to rotatably rotate in a rotational direction to move in the direction, the cylindrical punch including a protruding portion and a groove portion that are provided on an outer circumferential surface of the cylindrical punch along the rotational direction, the protruding portion comprising a bending protrusion configured to apply pressure to the fixing portion to bend the fixing portion, and the groove portion comprising a package separating protrusion configured to apply pressure to a semiconductor package of the plurality of semiconductor packages with a bent fixing portion to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion; and
a driver configured to rotatably move the cylindrical punch in the direction,
wherein the bending protrusion is one of a plurality of bending protrusions sequentially formed on the protruding portion along the rotational direction, and
wherein the package separating protrusion is one of a plu

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lim Jong Ho
• Song Jong Sup
• Joung Houn

Classifications

• H01L33/0095

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L2933/0033

  Electricity · mapped topic

• H01L33/005 Primary

  Electricity · mapped topic

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title