Electronic device
US-2016313769-A1 · Oct 27, 2016 · US
US10644044B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10644044-B2 |
| Application number | US-201815994988-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2018 |
| Priority date | May 31, 2018 |
| Publication date | May 5, 2020 |
| Grant date | May 5, 2020 |
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Methods are provided for fabricating photodetector arrays using passive matrix addressing technology. The photodetector arrays use a pair of switching diode and photo diode to overcome crosstalk issues within the passive matrix. The switching diode and the photo diode of each pixel may be connected using a cathode-to-cathode connection, or an anode-to-anode connection. The photodetector arrays are fabricated by assembling on a first substrate, an array of photodetector pixels comprising a switching diode and a photo diode, providing conductive lines for each row of the array and conductive lines for each column of the array, and attaching a second substrate to the first substrate. The photodetector array may also be fabricated by assembling on a first substrate an array of switching diodes, and assembling on a second substrate an array of photo diodes, and bonding the first and second substrates together.
Opening claim text (preview).
The invention claimed is: 1. A method of fabricating a photodetector array, comprising: assembling, on a face of a first substrate, an array of photodetector pixels, wherein each photodetector pixel comprises a switching diode and a photo diode, the switching diode and the photo diode being connected with a cathode-to-cathode connection; forming, for each row of the array, first conductive lines connecting each pixel within their respective row; applying a conductive adhesive at a bonding section of each photodetector pixel; forming, on a face of a second substrate second conductive lines for each column of the array; placing a dielectric material layer on each second conductive line; bonding the face of the first substrate with the face of the second substrate using the conductive adhesive; placing a light exposure mask over the array, wherein the light exposure mask exposes every photo diode; wherein positions of the dielectric material layers correspond to areas where the first conductive lines and the second conductive lines intersect. 2. The method of claim 1 , wherein the bonding area of each photodetector pixel is adjacent to the switching diode and the photo diode. 3. The method of claim 1 , wherein assembling the array of photodetector pixels comprises making the switching diode and the photo diode from the same material. 4. The method of claim 1 , wherein assembling the array of photodetector pixels comprises making the switching diode from first materials and making the photo diode from second materials. 5. The method of claim 4 , wherein the first materials comprise indium tin oxide (ITO), ZnO, poly(carbazole-dithiophene-benzothiadiazole) (PCDTBT): [6,6]-phenyl-C71-butyric acid methyl ester (PC 70 BM), PCDTBT, MoO x , and Ag, and the second materials comprise ITO, ZnO, PCDTBT:PC 70 BM, MoO x , and Ag. 6. The method of claim 1 , wherein the first substrate and the second substrate are made of flexible material. 7. The method of claim 6 wherein the flexible material is polyethylene terephthalate (PET) film. 8. The method of claim 1 , wherein the first substrate is made from indium tin oxide (ITO) coated polyethylene terephthalate (PET) film, and wherein assembling the array of photodetector pixels comprises: printing etchant on the face of the first substrate to create a pattern of ITO. 9. The method of claim 8 , wherein assembling the array of photodetector pixels comprises: blade coating ZnO and an active layer over the pattern of ITO. 10. The method of claim 9 , wherein assembling the array of photodetector pixels comprises: printing a pattern of vanadium oxide solution, using at least one of flexo printing or gravure printing. 11. The method of claim 10 , wherein assembling the array of photodetector pixels comprises: printing a layer of polymer on the switching diode for each photodetector pixel, using at least one of flexo printing or gravure printing. 12. The method of claim 11 , wherein the first conductive lines and the second conductive lines are created by printing silver nano particle ink, using at least one of flexo printing or gravure printing.
for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix {no fixed position being assigned to or needed to be assigned to the individual characters or partial characters} · CPC title
using a passive matrix · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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