Semiconductor device

Patent metadata

Field	Value
Publication number	US-10643918-B2
Application number	US-201816140132-A
Country	US
Kind code	B2
Filing date	Sep 24, 2018
Priority date	Nov 22, 2017
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

A semiconductor device includes a printed wiring board; a first semiconductor module including a first package body and a first heat radiation surface on one surface of the first package body, another surface of the first package body, opposite to the first heat radiation surface, faces one face of the printed wiring board; a first heat radiator on the first heat radiation surface; a second semiconductor module including a second package body and a second heat radiation surface on one surface of the second package body, another surface of the second package body, opposite to the second heat radiation surface, faces another face of the printed wiring board; and a second heat radiator provided on the second heat radiation surface. The first and second semiconductor modules are arranged to overlap each other in a plan view. The second semiconductor module is connected in parallel to the first semiconductor module.

First claim

What is claimed is:

1. A semiconductor device comprising:
a printed wiring board;
a first semiconductor module including a first package body and a first heat radiation surface, the first package body including a first semiconductor element, the first heat radiation surface being provided at one surface of the first package body and configured to radiate heat generated in the first semiconductor element, the first semiconductor module being disposed such that another surface of the first package body, opposite to the first heat radiation surface, faces one face of the printed wiring board;
a first heat radiator provided on the first heat radiation surface of the first semiconductor module;
a second semiconductor module including a second package body and a second heat radiation surface, the second package body including a second semiconductor element, the second heat radiation surface being provided at one surface of the second package body and configured to radiate heat generated in the second semiconductor element, the second semiconductor module being disposed such that another surface of the second package body, opposite to the second heat radiation surface, faces another face of the printed wiring board; and
a second heat radiator provided on the second heat radiation surface of the second semiconductor module,
wherein
the first semiconductor module and the second semiconductor module are arranged to overlap each other in a plan view,
the second semiconductor module is connected in parallel to the first semiconductor module,
the printed wiring board includes a plurality of terminal parts,
the first semiconductor module includes a plurality of first external connection terminals each provided to protrude from the first package body and connected to the first semiconductor element,
the second semiconductor module includes a plurality of second external connection terminals each provided to protrude from the second package body and connected to the second semiconductor element, and
the second semiconductor module is connected in parallel to the first semiconductor module such that each of the second external connection terminals is connected to each of the first external connection terminals via each of the terminal parts of the printed wiring board.

2. The semiconductor device according to claim 1 , wherein
each of the first external connection terminals includes a first base end portion on a side near the first package body and a first tip end portion protruding in a direction from the first base end portion,
each of the second external connection terminals includes a second base end portion on a side near the second package body and a second tip end portion protruding in a direction from the second base end portion,
the first base end portion of each of the first external connection terminals and the second base end portion of each of the second external connection terminals are arranged in a mirror image positional relation, and
the second tip end portion of each of the second external connection terminals is connected to the first tip end portion of each of the first external connection terminals via each of the terminal parts of the printed wiring board.

3. The semiconductor device according to claim 2 , wherein the second tip end portion of each of the second external connection terminals is nested with respect to the first tip end portion of each of the first external connection terminals.

4. The semiconductor device according to claim 2 , wherein at least one of each of the first external connection terminals and each of the second external connection terminals includes a press-fit terminal.

5. The semiconductor device according to claim 2 , wherein at least one of each of the first external connection terminals and each of the second external connection terminals includes a spring terminal.

6. The semiconductor device according to claim 2 , wherein at least one of each of the first external connection terminals and each of the second external connection terminals includes a plate-shaped terminal that is bent in parallel with the printed wiring board and is in surface contact with each of the terminal parts.

7. The semiconductor device according to claim 6 , wherein
each of the second external connection terminals includes a plate-shaped terminal that is bent inward of the second semiconductor module and is in surface contact with each of the terminal parts of the printed wiring board, and
the second tip end portion of each of the second external connection terminals is nested with respect to the first tip end portion of each of the first external connection terminals.

8. The semiconductor device according to claim 2 , wherein
the printed wiring board includes a through hole in each of the terminal parts,
at least one of each of the first external connection terminals and each of the second external connection terminals penetrates the through hole, and
the second tip end portion of each of the second external connection terminals is connected to the first tip end portion of each of the first external connection terminals.

9. The semiconductor device according to claim 8 , wherein
each of the second external connection terminals includes a recessed shape in the second tip end portion, and
each of the first external connection terminals includes, in the first tip end portion, a protruding shape to be fitted to the recessed shape of the second tip end portion.

10. The semiconductor device according to claim 9 , wherein the recessed shape is a hole or a bifurcated slit.

11. The semiconductor device according to claim 8 , wherein
each of the second external connection terminals includes an L shape in the second tip end portion, and
in each of the first external connection terminals, the first tip end portion is in contact with a bottom surface or a side surface of the L shape of the second tip end portion.

12. The semiconductor device according to claim 8 , wherein
each of the second external connection terminals includes a tapered shape in the second tip end portion, and
each of the first external connection terminals includes, in the first tip end portion, a tapered shape to be in contact with the tapered shape of the second tip end portion.

13. The semiconductor device according to claim 1 , wherein
each of the first external connection terminals includes a first tip end portion protruding in a direction from the first package body,
each of the second external connection terminals includes a second tip end portion protruding in a direction from the second package body,
the second tip end portion of each of the second external connection terminals is disposed to be shifted in a direction parallel to a plane of the printed wiring board, corresponding to a width or a thickness of the first tip end portion of each of the first external connection terminals, and
the second tip end portion is in contact with a side surface of the first tip end portion of each of the first external connection terminals via each of the terminal parts of the printed wiring board.

Assignees

• Mitsubishi Electric Corp

Inventors

• Ichimura Toru

Classifications

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H01L2224/45099

  Electricity · mapped topic

• H01L2924/1815

  Electricity · mapped topic

• H01L2224/04042

  Electricity · mapped topic