Resistor element and resistor element assembly

Patent metadata

Field	Value
Publication number	US-10643769-B2
Application number	US-201916400335-A
Country	US
Kind code	B2
Filing date	May 1, 2019
Priority date	Oct 31, 2016
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.

First claim

What is claimed is:

1. A resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate;
first and second terminals respectively on the first and second end surfaces; and
a second resistor layer on the first resistor layer, connected to the first and second terminals,
wherein the first resistor layer comprises a copper-nickel (Cu—Ni)-based composition and the second resistor layer comprises a copper-manganese-tin (Cu—Mn—Sn)-based composition,
a material of the second resistor layer has an absolute value of a temperature coefficient of resistivity (TCR) of less than 100 ppm/° C., and
the first resistor layer is disposed between the base substrate and the second resistor layer.

2. The resistor element of claim 1 , wherein the first and second terminals are connected to respective opposing end portions of both the first and second resistor layers, and the first and second resistor layers are bonded to each other.

3. The resistor element of claim 1 , wherein the second resistor layer is between the first resistor layer and the first terminal and between the first resistor layer and the second terminal.

4. The resistor element of claim 1 , wherein the first and second resistor layers each include a groove as a region.

5. The resistor element of claim 1 , further comprising:
a first protective layer on the first and second resistor layers and including glass; and
a second protective layer on the first protective layer and including a polymer.

6. The resistor element of claim 1 , wherein the first and second terminals respectively include first and second internal electrodes on the base substrate, and respectively include first and second external electrodes respectively on the first and second internal electrodes.

7. The resistor element of claim 1 , wherein the first resistor layer further comprises glass, and is bonded to the base substrate.

8. A resistor element assembly comprising:
a circuit board having a plurality of electrode pads; and
the resistor element of claim 1 disposed on the circuit board and electrically connected to the plurality of electrode pads.

9. A resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate;
a first terminal including a first internal electrode on the first surface of the base substrate and a first external electrode on the first internal electrode; and
a second terminal including a second internal electrode on the first surface of the base substrate and a second external electrode on the second internal electrode; and
a second resistor layer on the first resistor layer and connected to the first and second terminals,
wherein the first resistor layer comprises a copper-nickel (Cu—Ni)-based composition and the second resistor layer comprises a copper-manganese-tin (Cu—Mn—Sn)-based composition, and
the first resistor layer is disposed between the base substrate and the second resistor layer.

10. The resistor element of claim 9 , further comprising:
a first protective layer on the second resistor layer; and
a second protective layer on the first protective layer,
wherein the first resistor layer, the second resistor layer, and the first protective layer each include a groove as a region.

11. The resistor element of claim 9 , wherein the first internal electrode extends from an edge at which the first end surface and the first surface of the base substrate meet, and the second internal electrode extends from an edge at which the second end surface and the first surface of the base substrate meet.

12. The resistor element of claim 9 , further comprising:
a first protective layer on the first and second resistor layers and including glass; and
a second protective layer on the first protective layer and including a polymer.

13. The resistor element of claim 9 , wherein the first and second terminals include first and second internal electrodes disposed on the base substrate, respectively, and include first and second external electrodes disposed on the first and second internal electrodes, respectively.

14. The resistor element of claim 9 , wherein a material of the second resistor layer has an absolute value of a temperature coefficient of resistivity (TCR) of 100 ppm/° C. or less.

15. The resistor element of claim 9 , wherein the first resistor layer further comprises glass, and is bonded to the base substrate.

16. A resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate;
first and second terminals respectively on the first and second end surfaces; and
first and second resistors separated across the first resistor layer and respectively connected to the first and second terminals,
wherein the first resistor is disposed between the first resistor layer and the first terminal and the second resistor is disposed between the first resistor layer and the second terminal, and
the first and second resistors include a copper-manganese-tin (Cu—Mn—Sn)-based composition.

17. The resistor element of claim 16 , wherein the first resistor layer comprises a copper-nickel (Cu—Ni)-based composition.

18. The resistor element of claim 16 , further comprising:
a first protective layer on the first and second resistor layers and including glass; and
a second protective layer on the first protective layer and including a polymer.

19. The resistor element of claim 16 , wherein the first and second terminals include first and second internal electrodes disposed on the base substrate, respectively, and include first and second external electrodes disposed on the first and second internal electrodes, respectively.

20. The resistor element of claim 16 , wherein a material of the second resistor layer has an absolute value of a temperature coefficient of resistivity (TCR) of 100 ppm/° C. or less.

Assignees

• Samsung Electro Mech

Inventors

• Park Kwang Hyun
• Yun Jang Seok
• Baek Kyung Seon

Classifications

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title

• H01C1/01

  Mounting; Supporting · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C7/18 Primary

  comprising a plurality of layers stacked between terminals · CPC title