Surface geometry for adhesive bonding of polymer components

US10639864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10639864-B2
Application numberUS-201715479401-A
CountryUS
Kind codeB2
Filing dateApr 5, 2017
Priority dateApr 5, 2017
Publication dateMay 5, 2020
Grant dateMay 5, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of joining polymer components includes additively manufacturing first and second mating features on first and second polymer components such that a mechanical lock is created through undercut geometric features of an adhesive material when the polymer components are joined. Adhesive is added between the mating components to strengthen the joint.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of bonding polymer components comprises: additively manufacturing a first polymer component having a first recess, wherein the first recess includes a first undercut wall structure; additively manufacturing a second polymer component having a second recess, the second recess designed to fit with the first recess, wherein the second recess includes a second undercut wall structure; additively manufacturing bumper connected to an edge of the first polymer component and connected to an edge of the second polymer component; and joining the first and second polymer components with an adhesive by entirely filling the first recess and the second recess with the adhesive to form a mechanical lock wherein the mechanical lock comprises the first recess, the second recess and the adhesive. 2. The method of claim 1 , wherein the edges of the first and second polymer components are tapered. 3. The method of claim 1 , further comprising additively manufacturing a first buried taper adjacent to the edge of the first polymer component and a second buried taper adjacent to the edge of the second polymer component. 4. A method of bonding polymer components comprises: additively manufacturing a first polymer component having a recessed ring; additively manufacturing a second polymer component having a raised ring, the raised ring designed to fit with the recessed ring; additively manufacturing bumper connected to an edge of the first polymer component and connected to an edge of the second polymer component; and joining the first and second polymer components with an adhesive by entirely filling the first recess and the second recess with the adhesive to form a mechanical lock wherein the mechanical lock comprises the recessed ring, the raised ring, and the adhesive.

Assignees

Inventors

Classifications

  • Joining of substantially the whole surface of the articles (methods or apparatus for laminating B32B37/00) · CPC title

  • containing additives (C09J11/00 and subgroups take precedence) · CPC title

  • B29C65/483Primary

    Reactive adhesives, e.g. chemically curing adhesives · CPC title

  • Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore {(B29C48/001 takes precedence)} · CPC title

  • the rivets being integral with one of the parts to be joined, i.e. staking · CPC title

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Frequently asked questions

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What does patent US10639864B2 cover?
A method of joining polymer components includes additively manufacturing first and second mating features on first and second polymer components such that a mechanical lock is created through undercut geometric features of an adhesive material when the polymer components are joined. Adhesive is added between the mating components to strengthen the joint.
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification B29C65/483. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 05 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).