Transversely-excited film bulk acoustic resonator with a back-side dielectric layer
US-2024396526-A1 · Nov 28, 2024 · US
US10637434B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10637434-B2 |
| Application number | US-201715724567-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 4, 2017 |
| Priority date | Nov 8, 2016 |
| Publication date | Apr 28, 2020 |
| Grant date | Apr 28, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, a support member that is provided on the piezoelectric substrate so as to surround the IDT electrode, a cover that covers the support member, via electrodes that penetrate through the support member and the cover, and bumps that are bonded to the via electrodes. The IDT electrode is located in a hollow space that is enclosed by the piezoelectric substrate, the support member and the cover. A protruding portion extends along at least a portion of an outer peripheral edge of a surface of the cover that is on the opposite side from the piezoelectric substrate, and the protruding portion extends in a direction away from the piezoelectric substrate.
Opening claim text (preview).
What is claimed is: 1. An elastic wave device comprising: a piezoelectric body; a functional electrode that is provided on the piezoelectric body; a support member that is provided on the piezoelectric body and surrounds the functional electrode; a cover that covers the support member; a via electrode that penetrates through the support member and the cover; and a bump that is bonded to the via electrode; wherein the functional electrode is located in a hollow space enclosed by the piezoelectric body, the support member and the cover; a protruding portion extends along at least a portion of an outer peripheral edge of a surface of the cover that is on an opposite side from the piezoelectric body; the protruding portion extends in a direction away from the piezoelectric body; and the support member includes an opening that defines the hollow space, and the functional electrode is located in the opening of the support member. 2. The elastic wave device according to claim 1 , wherein, in plan view, the protruding portion is frame-shaped or substantially frame-shaped and is provided along an entire outer peripheral edge of the surface of the cover that is on the opposite side from the piezoelectric body. 3. The elastic wave device according to claim 1 , wherein the cover includes a resin. 4. The elastic wave device according to claim 1 , wherein the cover includes a first layer that is provided on the support member, and a second layer that is provided on the first layer. 5. The elastic wave device according to claim 1 , wherein the functional electrode is an IDT electrode. 6. A high-frequency front end circuit comprising: the elastic wave device according to claim 1 ; and a power amplifier. 7. The high-frequency front end circuit according to claim 6 , wherein, in plan view, the protruding portion is frame-shaped or substantially frame-shaped and is provided along an entire outer peripheral edge of the surface of the cover that is on the opposite side from the piezoelectric body. 8. The high-frequency front end circuit according to claim 6 , wherein the cover includes a resin. 9. The high-frequency front end circuit according to claim 6 , wherein the cover includes a first layer that is provided on the support member, and a second layer that is provided on the first layer. 10. The high-frequency front end circuit according to claim 6 , wherein the functional electrode is an IDT electrode. 11. A communication device comprising: the high-frequency front end circuit according to claim 6 ; and an RF signal processing circuit. 12. The communication device according to claim 11 , wherein, in plan view, the protruding portion is frame-shaped or substantially frame-shaped and is provided along an entire outer peripheral edge of the surface of the cover that is on the opposite side from the piezoelectric body. 13. The communication device according to claim 11 , wherein the cover includes a resin. 14. The communication device according to claim 11 , wherein the cover includes a first layer that is provided on the support member, and a second layer that is provided on the first layer. 15. The communication device according to claim 11 , wherein the functional electrode is an IDT electrode.
Niobates; Vanadates; Tantalates · CPC title
using surface acoustic waves · CPC title
for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title
for surface acoustic wave devices · CPC title
of lithium niobate or lithium-tantalate substrates · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.