Self-aligned via interconnect structures
US-10395984-B2 · Aug 27, 2019 · US
Structure and method of metal wraparound for low via resistance
US10636737B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10636737-B2 |
| Application number | US-201816106679-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 21, 2018 |
| Priority date | Aug 21, 2018 |
| Publication date | Apr 28, 2020 |
| Grant date | Apr 28, 2020 |
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- Title
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Abstract
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A semiconductor device includes a contact via and a metal interconnect on the contact via. The metal interconnect has a portion extending in a lengthwise direction that is wrapped around and in contact with a sidewall of the contact via. Along a widthwise direction, the metal interconnect does not contact the sidewall of the contact via.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a contact via; and a metal interconnect on the contact via, the metal interconnect having a portion extending in a lengthwise direction wrapped around and in contact with a sidewall of the contact via, wherein along a widthwise direction the metal interconnect does not contact the sidewall of the contact via. 2. The semiconductor device of claim 1 , wherein the portion of the metal interconnect extending in the lengthwise direction wrapped around and in contact with the sidewall of the contact via overlaps the contact via by a wrap depth in the range of 1 nm to 40 nm. 3. The semiconductor device of claim 1 , wherein the metal interconnect is comprised of a metal selected from the group consisting of tungsten, cobalt, ruthenium, and copper. 4. The semiconductor device of claim 1 , wherein the metal interconnect is a first back-end-of-line metal layer, and the contact via couples the metal interconnect with a middle-of-line contact. 5. The semiconductor device of claim 1 integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US10636737B2 cover?
- A semiconductor device includes a contact via and a metal interconnect on the contact via. The metal interconnect has a portion extending in a lengthwise direction that is wrapped around and in contact with a sidewall of the contact via. Along a widthwise direction, the metal interconnect does not contact the sidewall of the contact via.
- Who is the assignee on this patent?
- Qualcomm Inc
- What technology area does this patent fall under?
- Primary CPC classification H01L23/5226. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).