Photonic integrated circuit with laser and isolator

Patent metadata

Field	Value
Publication number	US-10634843-B2
Application number	US-201916271833-A
Country	US
Kind code	B2
Filing date	Feb 10, 2019
Priority date	Apr 24, 2018
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

An optoelectronic device includes a substrate, having a recess formed therein. An optical isolator is mounted in the recess. A laser includes a stack of epitaxial layers on the substrate and emits a beam of radiation toward the recess along a direction parallel to a surface of the substrate. A waveguide directs the beam emitted by the laser into the optical isolator.

First claim

The invention claimed is:

1. An optoelectronic device, comprising:
a substrate, having a device layer thereon and having a recess formed therein and extending at least through the device layer;
an optical isolator mounted in the recess and comprising an input face and an output face;
a laser comprising a stack of epitaxial layers on the substrate and configured to emit a beam of radiation toward the recess along a direction parallel to a surface of the substrate; and
a waveguide formed in the device layer and configured to direct the beam emitted by the laser toward the recess and into the input face of the optical isolator.

2. The device according to claim 1 , wherein the waveguide has an entrance in proximity to the laser and an exit in proximity to the recess and is tapered along a direction of the beam between the entrance and the exit.

3. The device according to claim 2 , wherein the exit of the waveguide is smaller than the entrance and has a transverse dimension that is less than a wavelength of the radiation emitted by the laser.

4. The device according to claim 2 , wherein a transverse dimension of the waveguide widens adiabatically from the entrance to the exit.

5. The device according to claim 2 , wherein the waveguide is tapered in both a horizontal dimension, parallel to the surface of the substrate, and in a vertical dimension, perpendicular to the surface of the substrate.

6. The device according to claim 1 , wherein there is no lens between the laser and the optical isolator.

7. The device according to claim 1 , wherein the input face of the optical isolator is positioned to receive the beam from the waveguide, and the beam exits the optical isolator through the output face, and wherein the device comprises one or more further photonic components on the substrate and a further waveguide configured to guide the beam from the output face of the optical isolator toward the one or more further photonic components.

8. The device according to claim 7 , wherein there is no lens between the optical isolator and the further photonic components.

9. The device according to claim 1 , wherein the optical isolator comprises a bulk Faraday rotator.

10. The device according to claim 9 , wherein the optical isolator comprises an input polarizer positioned to receive the beam from the waveguide, and an output polarizer, which has a direction of polarization that is rotated relative to the input polarizer and through which the beam exits the optical isolator.

11. The device according to claim 1 , wherein the substrate comprises a semiconductor material.

12. The device according to claim 11 , wherein the semiconductor material comprises silicon.

13. The device according to claim 1 , wherein the substrate comprises a dielectric material.

14. The device according to claim 1 , wherein the recess has a closed bottom, and the optical isolator is mounted on the bottom of the recess.

15. The device according to claim 1 , and comprising an optical interposer, wherein the recess passes through the substrate, and wherein both the substrate and the optical isolator are mounted on the optical interposer.

16. The device according to claim 15 , wherein the optical interposer has an indentation, which is aligned with the recess in the substrate and in which the optical isolator is mounted.

17. An optoelectronic device, comprising:
a substrate, having a recess formed therein;
a bulk optical isolator, comprising a single crystal of a magneto-optic material, having input and output faces, mounted in the recess;
a first tapered waveguide formed on the substrate and configured to direct a beam of radiation into the optical isolator through the input face; and
a second tapered waveguide formed on the substrate and configured to receive and guide the beam of radiation from the output face of the optical isolator to a further photonic component.

18. The device according to claim 17 , wherein the first and second tapered waveguides comprise silicon nitride and are surrounded by one or more layers of silicon dioxide.

19. The device according to claim 18 , wherein a portion of the one or more layers of silicon dioxide that is in proximity to the recess is surrounded by air.

20. A method for manufacturing an optoelectronic device, the method comprising:
forming a recess in a substrate having a device layer thereon such that the recess extends at least through the device layer;
mounting an optical isolator, having an input face and an output face, in the recess;
depositing a stack of epitaxial layers on the substrate so as to define a laser, which is configured to emit a beam of radiation toward the recess along a direction parallel to a surface of the substrate; and
forming a waveguide in the device layer on the substrate so as to direct the beam emitted by the laser toward the recess and into the input face of the optical isolator.

Assignees

• Apple Inc

Inventors

• Bayn Igal I
• Sutton Andrew J
• Shpunt Alexander
• Pelc Jason S
• Arbore Mark A

Classifications

• G02B2006/12157

  Isolator · CPC title

• G02B2006/12116

  Polariser; Birefringent · CPC title

• G02B6/13

  Integrated optical circuits characterised by the manufacturing method · CPC title

• G02B2006/12061

  Silicon · CPC title

• G02B6/1228 Primary

  Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305) · CPC title