Method for producing a vig unit having improved temperature profile
US-2019368264-A1 · Dec 5, 2019 · US
US10633913B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10633913-B2 |
| Application number | US-201815899830-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 20, 2018 |
| Priority date | Feb 17, 2017 |
| Publication date | Apr 28, 2020 |
| Grant date | Apr 28, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An arrangement for producing vacuum insulated glazing (VIG) unit and an evacuation cup suitable for such use as well as a method therefore is presented so as to provide a more uniform or homogeneous heating of the part of the glass pane containing the evacuation hole and possibly a soldering material arranged around the evacuation hole, in particular for the reason of preventing larger temperature gradients in the glass pane between the part covered by the evacuation cup and the remaining part and for avoiding excessive locale temperatures of the glass pane under the evacuation cup, which may be harmful the durability of the glass pane, in particular when the glass pane is made from tempered glass, where the tempering of the glass may be influenced by excessive temperatures.
Opening claim text (preview).
The invention claimed is: 1. Method for providing a vacuum to a vacuum insulated glazing (VIG) unit comprising two glass panes which delimit a void therebetween, wherein one of the glass panes includes an evacuation hole therethrough, by means of an evacuation cup comprising a housing wall, a first cavity within the housing wall arranged to be in fluid communication with the evacuation hole of the VIG unit by a first opening of the first cavity, a first plane land enclosing the first opening, a first conduit extending through the housing wall and disposed in fluid communication with the first cavity, and a second plane land enclosing the first plane land and defining a second cavity within the housing wall with a second opening situated between the first plane land and the second plane land, a second conduit connecting the second cavity and an outside of the housing wall, the method comprising: arranging the evacuation cup on a first glass pane so that the evacuation hole is in fluid communication with the first cavity by the first opening of the first cavity; placing the VIG unit in a furnace; heating air of an interior of the furnace with the VIG unit to a first temperature; heating the housing wall of the evacuation cup to a second temperature by a first heating arrangement placed outside the first cavity of the evacuation cup while the air temperature of the furnace is at said first temperature, the second temperature being at least 5° C. higher than the first temperature; evacuating the void by pumping out the first cavity of the evacuation cup through the first conduit; pumping out the second cavity through the second conduit; wherein the heating of the housing wall to the second temperature provides convection heating of a soldering material within the first cavity; wherein the soldering material is arranged inside or covered by the first cavity; and wherein the heating of the housing wall provides heating of the soldering material such that the soldering material is heated to a condition where the soldering material, at least one of, flows and forms an air tight seal. 2. The method according to claim 1 , further comprising maintaining the air temperature of the furnace at said first temperature while the housing wall is maintained at said second temperature for at least for 5 minutes so as to heat a soldering material surrounding the evacuation hole. 3. The method according to claim 2 , wherein the soldering material is heated to a condition where the soldering material flows. 4. The method according to claim 3 , wherein the soldering material is heated to a higher temperature than necessary to reach the flowing condition of the soldering material so as to perform a heat treatment of the soldering material. 5. The method according to claim 2 , wherein said soldering material comprises a low-melting temperature glass solder frit. 6. The method according to claim 2 , wherein the soldering material is heated after the evacuation of the void is conducted to seal off the evacuation hole. 7. The method according to claim 1 , wherein the housing wall of the evacuation cup is heated so that a temperature of the first glass pane covered by the first cavity of the evacuation cup is substantially the same as a temperature of the first glass pane that is not covered by the evacuation cup. 8. The method according to claim 1 , further comprising heating a distal tip of a tube extending from the evacuation hole by means of a second heating arrangement so as to seal the distal tip, and placing a second heating element inside the first cavity of the evacuation cup. 9. The method according to claim 1 , wherein the evacuation cup comprises: a housing wall, a first cavity within the housing wall arranged to be in fluid communication with the evacuation hole of the VIG unit by a first opening of the first cavity, a first plane land enclosing the first opening, a first conduit extending through the housing wall and disposed in fluid communication with the first cavity, and a first heating arrangement placed outside of the first cavity of the evacuation cup, the first heating arrangement configured to heat the housing wall distributedly along a perimeter of the first cavity. 10. The method according to claim 1 , further comprising placing a soldering material in the evacuation hole prior to evacuation and sealing the soldering material to the evacuation hole prior to evacuation by heating the housing wall to the second temperature.
Heat treatment (for soldering E06B3/67334) · CPC title
Evacuated glazing units · CPC title
Evacuating or filling the gap during assembly · CPC title
by soldering; Preparing the panes therefor · CPC title
Cross-Sectional Technologies · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.