Low thermal expansion superalloy and manufacturing method thereof

US10633717B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10633717-B2
Application numberUS-201615763617-A
CountryUS
Kind codeB2
Filing dateJul 29, 2016
Priority dateSep 29, 2015
Publication dateApr 28, 2020
Grant dateApr 28, 2020

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Abstract

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A low thermal expansion superalloy is composed of, in mass %, 0.1% or less of C, 0.1-1.0% of Si, 1.0% or less of Mn, 25-32% of Ni, more than 18% but less than 24% of Co, more than 0.25% but 1.0% or less of Al, 0.5-1.5% of Ti, more than 2.1% but less than 3.0% of Nb, 0.001-0.01% of B and 0.0005-0.01% of Mg, with the balance of Fe and unavoidable impurities, while satisfying Mg/S≥1, 52.9≤1.235Ni+Co<55.8%, (Al+Ti+Nb) is 3.5-5.5%, and the F value is 8% or less. In the superalloy, a granular intermetallic compound containing Si, Nb, and Ni alone or in a total amount of 36 mass % or more is precipitated at a grain boundary of an austenite matrix, and an intermetallic compound including a larger concentration of Ni, Al, Ti, and Nb and having 50 nm or smaller of an average diameter is precipitated in the austenite matrix.

First claim

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The invention claimed is: 1. A low thermal expansion superalloy including, in terms of mass %, 0.1% or less of C, 0.1% to 1.0% of Si, 1.0% or less of Mn, 25% to 32% of Ni, more than 18% and less than 24% of Co, more than 0.25% and 1.0% or less of Al, 0.5% to 1.5% of Ti, more than 2.1% and less than 3.0% of Nb, 0.001% to 0.01% of B, 0.0005% to 0.01% of Mg, a remainder of Fe, and inevitable impurities, wherein relationships of: Mg/S≥1, 52.9%≤1.235Ni+Co<55.8%, 3.5% or more and less than 5.5% of Al+Ti+Nb, and 8% or less of an absolute value of F value are satisfied, wherein the F value is calculated based on: F value=0.0014Ni+0.6Co−6.8Al+7.6Ti−5.3Nb−0.11Fe, wherein a granular intermetallic compound containing one or more elements of Si, Nb, and Ni alone or in a total amount of 36 mass % or more is precipitated at a grain boundary of an austenite matrix, and the low thermal expansion superalloy has a structure in which an intermetallic compound including a larger concentration of Ni, Al, Ti, and Nb than that of the alloy and having 50 nm or smaller of a diameter by an average value is precipitated in the austenite matrix. 2. The low thermal expansion superalloy according to claim 1 , having a composition including, in terms of mass %, 0.05% or less of C, 0.2% to 0.7% of Si, 0.5% or less of Mn, 26% to 29% of Ni, more than 18% and 22% or less of Co, 0.3% to 0.6% of Al, 0.6% or more and less than 1.2% of Ti, 2.5% or more and less than 3.0% of Nb, 0.001% to 0.01% of B, 0.0005% to 0.01% of Mg, a remainder of Fe, and inevitable impurities, in which relationships of Mg/S≥1, 52.9%≤1.235Ni+Co<55.8%, 3.5% to 4.7% of Al+Ti+Nb, and 6% or less of the absolute value of the F value are satisfied, wherein the F value is calculated based on: F value=0.0014Ni+0.6Co−6.8Al+7.6Ti−5.3Nb−0.11Fe. 3. The low thermal expansion superalloy according to claim 1 , further including 0.1% or more and less than 1.7% of Cr in terms of mass %. 4. The low thermal expansion superalloy according to claim 1 , further including 0.4% to 1.6% of Cr in terms of mass %. 5. The low thermal expansion superalloy according to claim 1 , wherein reduction of area in a room temperature tensile test in a solution treated state of the low thermal expansion superalloy is 50% or higher. 6. The low thermal expansion superalloy according to claim 1 , wherein an average thermal expansion coefficient at 30° C. to 500° C. in an aging treated state is 8.1×10 −6 /° C. or lower, tensile strength at room temperature is 780 MPa or higher, tensile strength at 550° C. is 600 MPa or higher, a parallel portion thereof ruptures in a combination smooth/notched creep test under a stress of 510 MPa at 650° C. and elongation after rupture is 10% or more, and in an oxidation test at 600° C. in the air for 100 hours, an oxide layer is not spalled and an oxidation weight gain is 1.3 mg/cm 2 or less. 7. A manufacturing method for a low thermal expansion superalloy having the composition of the low thermal expansion superalloy according to claim 1 , the method comprising: performing vacuum induction melting on the low thermal expansion superalloy to obtain an ingot; performing hot plastic working once or more by using the ingot; performing an solution treatment at 850° C. to 1080° C.; performing an aging treatment, at least once, including holding at 580° C. to 700° C. for 8 to 100 hours; causing precipitation of a granular intermetallic compound containing one or more elements of Si, Nb, and Ni alone or in a total amount of 36 mass % or more at a grain boundary of an austenite matrix; and causing precipitation of an intermetallic compound including a larger concentration of Ni, Al, Ti, and Nb than that of the alloy and having 50 nm or smaller of a diameter by an average value in the austenite matrix. 8. The manufacturing method for a low thermal expansion superalloy according to claim 7 , further comprising: performing electroslag remelting and/or vacuum arc remelting after the vacuum induction melting to manufacture an ingot.

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What does patent US10633717B2 cover?
A low thermal expansion superalloy is composed of, in mass %, 0.1% or less of C, 0.1-1.0% of Si, 1.0% or less of Mn, 25-32% of Ni, more than 18% but less than 24% of Co, more than 0.25% but 1.0% or less of Al, 0.5-1.5% of Ti, more than 2.1% but less than 3.0% of Nb, 0.001-0.01% of B and 0.0005-0.01% of Mg, with the balance of Fe and unavoidable impurities, while satisfying Mg/S≥1, 52.9≤1.235Ni+…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification C22C38/105. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).