Adhesive tape for encapsulating an organic electronic arrangement
US-2015162568-A1 · Jun 11, 2015 · US
US10633563B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10633563-B2 |
| Application number | US-201615770424-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 25, 2016 |
| Priority date | Nov 9, 2015 |
| Publication date | Apr 28, 2020 |
| Grant date | Apr 28, 2020 |
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The invention relates to a barrier adhesive mass having high breakthrough times for water and also providing a good adhesive performance. This is achieved by a barrier adhesive mass comprising at least one elastomer and at least one reactive resin, and is characterised in that the barrier adhesive mass comprises at least one polymer G containing at least two functions suitable for constructing a polymer, as well as at least two hydrolysable silyl groups. The invention also relates to an adhesive tape comprising a barrier adhesive mass according to the invention, and to the use of an adhesive mass of this type for sealing electronic assemblies.
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The invention claimed is: 1. A barrier adhesive compound, comprising at least one elastomer and at least one reactive resin, wherein; the barrier adhesive compound comprises at least one polymer G, containing at least two functional groups capable of building a polymer and at least two hydrolyzable silyl groups. 2. The barrier adhesive compound of claim 1 , wherein the at least one polymer G has a polyacrylate backbone. 3. The barrier adhesive compound of claim 1 , wherein the functional groups capable of building a polymer are selected independently of one another, and are selected from the group consisting of: vinyl groups, (meth)acrylate groups, hydroxy groups, amino groups, isocyanate groups, cyclic ether groups, and epoxy groups. 4. The barrier adhesive compound of claim 1 , wherein the functional groups capable of building a polymer are selected independently from one another, and are selected from: (meth)acrylate groups and epoxy groups. 5. The barrier adhesive compound of claim 1 , wherein the functional groups capable of building a polymer comprise epoxycycloalkyl groups. 6. The barrier adhesive compound of claim 1 , wherein the hydrolyzable silyl groups correspond to formula (I) —Si(OR 1 ) x R 2 3-x (I), in which: R 1 is a methyl and/or an ethyl residue; and, R 2 , is an alkyl and/or an aryl residue; and, x=1 to 3. 7. The barrier adhesive compound of claim 6 , wherein each R 1 is an ethyl residue. 8. The barrier adhesive compound of claim 6 , wherein x=2 or 3. 9. The barrier adhesive compound of claim 1 , wherein the at least one elastomer is a vinyl aromatic block copolymer. 10. The barrier adhesive compound of claim 1 , wherein the at least one reactive resin contains cyclic ether groups. 11. The barrier adhesive of claim 1 which contains 15-80% wt. of a reactive resin based on the total weight of the barrier adhesive compound. 12. The barrier adhesive compound of claim 1 , wherein the barrier adhesive compound is a pressure-sensitive adhesive compound. 13. An adhesive tape, comprising a barrier adhesive compound of claim 12 . 14. A method of sealing of electronic devices comprising the step of: applying the barrier adhesive compound of claim 1 to a surface of the electronic device.
Homopolymers or copolymers of monomers containing silicon · CPC title
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
in the substrate · CPC title
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title
based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds · CPC title
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