Polyester compositions and mobile electronic device components made therefrom
US-2018340062-A1 · Nov 29, 2018 · US
US10633536B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10633536-B2 |
| Application number | US-201616062136-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 2, 2016 |
| Priority date | Dec 21, 2015 |
| Publication date | Apr 28, 2020 |
| Grant date | Apr 28, 2020 |
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A resin composition which comprises 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, 5 to 80 parts by weight of an ethylene-α-olefin copolymer, 1 to 30 parts by weight of an epoxy group-containing silicon elastomer and 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound and has low-temperature impact resistance and suppresses delamination.
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The invention claimed is: 1. A resin composition comprising: (A) 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, (B) 5 to 80 parts by weight of an ethylene-α-olefin copolymer, (C) 1 to 30 parts by weight of an epoxy group-containing crosslinked silicone elastomer, and (D) 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound. 2. The resin composition according to claim 1 , wherein the resin is an aromatic polyester. 3. The resin composition according to claim 1 , wherein the ethylene-α-olefin copolymer is an ethylene-α-olefin copolymer modified with an unsaturated carboxylic acid or an acid derivative thereof. 4. The resin composition according to claim 1 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 5. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 1 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 6. The resin composition according to claim 2 , wherein the ethylene-α-olefin copolymer is an ethylene-α-olefin copolymer modified with an unsaturated carboxylic acid or an acid derivative thereof. 7. The resin composition according to claim 2 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 8. The resin composition according to claim 3 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 9. The resin composition according to claim 6 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 10. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 2 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 11. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 3 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 12. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 6 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 13. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 4 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 14. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 7 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 15. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 8 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 16. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 9 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.).
Polyester-carbonates · CPC title
Polythioethers; Polythioether-ethers · CPC title
Thiols · CPC title
Phosphorus bound to oxygen only · CPC title
used for thermoforming · CPC title
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