Thermoplastic resin composition and molded article thereof

US10633536B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10633536-B2
Application numberUS-201616062136-A
CountryUS
Kind codeB2
Filing dateDec 2, 2016
Priority dateDec 21, 2015
Publication dateApr 28, 2020
Grant dateApr 28, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition which comprises 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, 5 to 80 parts by weight of an ethylene-α-olefin copolymer, 1 to 30 parts by weight of an epoxy group-containing silicon elastomer and 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound and has low-temperature impact resistance and suppresses delamination.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising: (A) 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, (B) 5 to 80 parts by weight of an ethylene-α-olefin copolymer, (C) 1 to 30 parts by weight of an epoxy group-containing crosslinked silicone elastomer, and (D) 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound. 2. The resin composition according to claim 1 , wherein the resin is an aromatic polyester. 3. The resin composition according to claim 1 , wherein the ethylene-α-olefin copolymer is an ethylene-α-olefin copolymer modified with an unsaturated carboxylic acid or an acid derivative thereof. 4. The resin composition according to claim 1 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 5. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 1 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 6. The resin composition according to claim 2 , wherein the ethylene-α-olefin copolymer is an ethylene-α-olefin copolymer modified with an unsaturated carboxylic acid or an acid derivative thereof. 7. The resin composition according to claim 2 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 8. The resin composition according to claim 3 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 9. The resin composition according to claim 6 , wherein the resin is an aromatic polyester comprising 80 to 100 mol % of naphthalene dicarboxylic acid and 0 to 20 mol % of at least one selected from the group consisting of terephthalic acid and isophthalic acid as dicarboxylic acid components and ethylene glycol as a diol component. 10. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 2 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 11. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 3 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 12. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 6 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 13. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 4 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 14. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 7 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 15. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 8 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.). 16. A method of improving the low-temperature impact resistance of a molded article, wherein a molded article of the resin composition of claim 9 is heated at a temperature range from (glass transition temperature of the resin −40° C.) to (glass transition temperature of the resin +40° C.).

Assignees

Inventors

Classifications

  • C08L69/005Primary

    Polyester-carbonates · CPC title

  • Polythioethers; Polythioether-ethers · CPC title

  • Thiols · CPC title

  • Phosphorus bound to oxygen only · CPC title

  • used for thermoforming · CPC title

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Frequently asked questions

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What does patent US10633536B2 cover?
A resin composition which comprises 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, 5 to 80 parts by weight of an ethylene-α-olefin copolymer, 1 to 30 parts by weight of an epoxy group-containing silicon elastomer and 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, ph…
Who is the assignee on this patent?
Teijin Ltd
What technology area does this patent fall under?
Primary CPC classification C08L69/005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).