Inductor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10629364-B2
Application number	US-201715716579-A
Country	US
Kind code	B2
Filing date	Sep 27, 2017
Priority date	Apr 12, 2017
Publication date	Apr 21, 2020
Grant date	Apr 21, 2020

Abstract

An inductor includes a body in which is disposed a coil formed as a plurality of coil patterns connected by one or more via(s). Each via includes a first conductive layer and a second conductive layer formed on the first conductive layer, and a distance between portions of coil patterns connected by the via in the body is greater than a distance between other portions of the coil patterns in the body. Methods of forming inductors having vias including first and second conductive layers are also provided.

First claim

What is claimed is:

1. An inductor comprising:
a body in which a coil including a plurality of coil patterns connected by one or more vias is disposed,
wherein the plurality of coil patterns comprise a first coil pattern and a second coil pattern, and the one or more vias include a first via connecting a connection part of the first coil pattern and a connection part of the second coil pattern to each other,
a first distance, in a thickness direction of the inductor, between the connection part of the first coil pattern and the connection part of the second coil pattern is greater than a second distance, in the thickness direction of the inductor, between another part of the first coil pattern and another part of the second coil pattern,
the first via includes a first conductive layer and a second conductive layer disposed on the first conductive layer,
a side surface of the connection part of the first coil pattern connected to the via is spaced apart from a side surface of the another part of the first coil pattern by an insulating material of the body, and
a side surface of the connection part of the second coil pattern connected to the via is spaced apart from a side surface of the another part of the second coil pattern by the insulating material of the body.

2. The inductor of claim 1 , wherein the first conductive layer has a thickness within a ratio of 0.7 to 1.0 of the second distance.

3. The inductor of claim 1 , wherein a thickness of the second conductive layer is 3.0 μm to 7.0 μm.

4. The inductor of claim 1 , wherein the second conductive layer includes a metal having a hardness lower than that of the first conductive layer.

5. The inductor of claim 1 , wherein the first and second conductive layers have different compositions, and the first conductive layer includes at least one of silver (Ag), copper (Cu), and bismuth (Bi).

6. The inductor of claim 1 , wherein the first and second conductive layers have different compositions, and the second conductive layer includes at least one of tin (Sn), Sn—Ag, Sn—Cu, and Sn—Bi.

7. The inductor of claim 1 , wherein the body is formed of an insulating material.

8. The inductor of claim 7 , wherein the insulating material is at least one of a photosensitive resin, an epoxy group, an acrylic group, a polyimide group, a phenol group, and a sulfone group.

9. The inductor of claim 1 , wherein each of an upper and a lower surface of the connection part of the first coil pattern opposing each other is a flat surface, and
each of an upper and a lower surface of the connection part of the second coil pattern opposing each other is a flat surface.

10. The inductor of claim 1 , wherein the first via is the only via disposed between the first coil pattern and the second coil pattern.

11. An inductor comprising a body in which a coil including a plurality of coil patterns connected by one or more vias is disposed,
wherein the plurality of coil patterns comprise a first coil pattern and a second coil pattern, and
the one or more vias include a first via connecting the first coil pattern and the second coil pattern to each other,
the first via includes a first conductive layer having a convex end, and a second conductive layer disposed on the convex end of the first conductive layer and connecting the first conducive layer to the second coil pattern, and
the second conductive layer has a convex end facing the second coil pattern.

12. The inductor of claim 11 , wherein the first conductive layer has a thickness within a ratio of 0.7 to 1.0 of a distance between portions of the first and second coil patterns spaced apart from the first via.

13. The inductor of claim 11 , wherein a thickness of the second conductive layer is 3.0 μm to 7.0 μm.

14. The inductor of claim 11 , wherein the second conductive layer includes a metal having a hardness lower than that of the first conductive layer.

15. The inductor of claim 11 , wherein the first and second conductive layers have different compositions, and the first conductive layer includes at least one of silver (Ag), copper (Cu), and bismuth (Bi).

16. The inductor of claim 11 , wherein the first and second conductive layers have different compositions, and the second conductive layer includes at least one of tin (Sn), Sn—Ag, Sn—Cu, and Sn—Bi.

17. The inductor of claim 11 , wherein the body is formed of an insulating material.

18. The inductor of claim 17 , wherein the insulating material is at least one of a photosensitive resin, an epoxy group, an acrylic group, a polyimide group, a phenol group, and a sulfone group.

19. The inductor of claim 11 , wherein a central portion of the convex end of the second conductive layer is in contact with the second coil pattern, and edge portions of the convex end of the second conductive layer surrounding the central portion thereof are spaced apart from the second coil pattern.

Assignees

• Samsung Electro Mech

Inventors

• Paeng Se Woong
• Bae Jong Seok
• Kim Soo Yeol

Classifications

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F2005/006

  with conical spiral form · CPC title

• H01F41/02 Primary

  for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) · CPC title

• H01F41/10 Primary

  Connecting leads to windings (making electric connections in general H01R43/00) · CPC title

• H01F27/30

  Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support · CPC title