Resistive change memory
US-9520171-B2 · Dec 13, 2016 · US
US10629231B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10629231-B2 |
| Application number | US-201916250557-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2019 |
| Priority date | Mar 31, 2015 |
| Publication date | Apr 21, 2020 |
| Grant date | Apr 21, 2020 |
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A magnetoresistance effect element has a first ferromagnetic metal layer, a second ferromagnetic metal layer, and a tunnel barrier layer that is sandwiched between the first and second ferromagnetic metal layers, the tunnel barrier layer is expressed by a chemical formula of AB 2 O x , and has a spinel structure in which cations are arranged in a disordered manner, A represents a divalent cation that is either Mg or Zn, and B represents a trivalent cation that includes a plurality of elements selected from the group consisting of Al, Ga, and In.
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The invention claimed is: 1. A magnetoresistance effect element comprising: a first ferromagnetic metal layer; a second ferromagnetic metal layer; and a tunnel barrier layer that is sandwiched between the first and second ferromagnetic metal layers, wherein the tunnel barrier layer has a spinel structure, wherein the tunnel barrier layer comprises: at least one lattice-matched portion that is lattice-matched with both of the first ferromagnetic metal layer and the second ferromagnetic metal layer; and at least one lattice-mismatched portion that is not lattice-matched with at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer, and when viewed as an inverse Fourier transform image in a stacking direction of a cross-sectional crystal lattice image of the interface between the tunnel barrier layer and the first and/or the second ferromagnetic metal layer, a lattice-matched portion is made up of a plurality of sequential, continuously-connected lattice lines, and a lattice-mismatched portion is made up of a plurality of sequential, non-continuously-connected lattice lines and/or no lattice lines. 2. The magnetoresistance effect element according to claim 1 , wherein a volume ratio of the lattice-matched portion with respect to a volume of the entire tunnel barrier layer is 65% to 95%. 3. The magnetoresistance effect element according to claim 1 , wherein the number of constituent elements in a unit cell of the divalent cation is smaller than half that of the trivalent cation. 4. The magnetoresistance effect element according to claim 1 , wherein a magnetoresistance ratio is 100% or greater under application of a bias voltage of 1 V or greater at a room temperature. 5. The magnetoresistance effect element according to claim 1 , wherein the first ferromagnetic metal layer has larger coercivity than the second ferromagnetic metal layer. 6. The magnetoresistance effect element according to claim 1 , wherein at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer has magnetic anisotropy perpendicular to a stacking direction. 7. The magnetoresistance effect element according to claim 1 , wherein at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer is Co 2 Mn 1-a Fe a Al b SiI b (0≤a≤1, 0≤b≤1). 8. The magnetoresistance effect element according to claim 1 , wherein the tunnel barrier layer is expressed by a chemical formula of AB 2 O x (0<x≤4), A represents a divalent cation that is either Mg or Zn, and B represents a trivalent cation that is either Al, Ga or In. 9. The magnetoresistance effect element according to claim 1 , wherein cations are arranged in a disordered manner in the spinel structure. 10. A method of manufacturing a magnetoresistance effect element comprising the steps of: forming an under layer on a substrate; forming a first ferromagnetic metal layer on the under layer; forming a tunnel barrier layer on the first ferromagnetic metal layer; forming a second ferromagnetic metal layer on the tunnel barrier layer; and forming a cap layer on the second ferromagnetic metal layer, wherein the step of forming a tunnel barrier layer comprises the steps of: depositing a metal thin film on the first ferromagnetic metal layer; oxidizing the deposited metal thin film by plasma oxidation or natural oxidation by introducing oxide; and heat treating the oxidized metal thin film, and the step of oxidizing is performed after cooling the substrate to −70° C. to −30° C., and wherein the tunnel barrier layer comprises: at least one lattice-matched portion that is lattice-matched with both of the first ferromagnetic metal layer and the second ferromagnetic metal layer; and at least one lattice-mismatched portion that is not lattice-matched with at least one of the first ferromagnetic metal layer and the second ferromagnetic metal layer, and when viewed as an inverse Fourier transform image in a stacking direction of a cross-sectional crystal lattice image of the interface between the tunnel barrier layer and the first and/or the second ferromagnetic metal layer, a lattice-matched portion is made up of a plurality of sequential, continuously-connected lattice lines, and a lattice-mismatched portion is made up of a plurality of sequential, non-continuously-connected lattice lines and/or no lattice lines.
using magneto-resistive devices {or effects} · CPC title
Half-metallic, e.g. epitaxial CrO2 or NiMnSb films · CPC title
large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices · CPC title
Arrangements using a magnetic tunnel junction · CPC title
of IV type, e.g. Ge1-xMnx · CPC title
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