Heat sink for electronic component and associated manufacturing method
US-2024183524-A1 · Jun 6, 2024 · US
US10627174B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10627174-B2 |
| Application number | US-201414198801-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2014 |
| Priority date | Sep 29, 2009 |
| Publication date | Apr 21, 2020 |
| Grant date | Apr 21, 2020 |
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Substantially aligned boron nitride nano-element arrays prepared by contacting a carbon nano-element array with a source of boron and nitrogen; methods for preparing such arrays and methods for their use including use as a heat sink or as a thermally conductivity interface in microelectronic devices.
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What is claimed is: 1. An array of substantially aligned boron nitride nano-elements, the array comprising: a plurality of substantially aligned carbon nano-elements; and a plurality of boron nitride nano-elements formed on, and extending from, ends of said plurality of substantially aligned carbon nano-elements, the boron nitride formed from a source of boron atoms and a source of nitrogen atoms, wherein the source of boron atoms comprises a boron containing compound selected from a group consisting of BH 3 , B 2 H 4 , and B 2 H 6 . 2. The array of claim 1 wherein the array extends from a substrate. 3. The array of claim 1 wherein the nano-elements are nanotubes. 4. The array of claim 3 wherein the diameter of the nanotubes is from about 5 nm to about 20 nm. 5. The array of claim 3 wherein the length of the nanotubes is from about 100 nm to about 100 μm. 6. The array of claim 3 wherein the source of nitrogen atoms comprises a nitrogen containing compound selected from the group consisting of N 2 , NH 3 and N 2 H 4 . 7. An electronic device comprising: at least one of a heat-generating component and a heat sink; and an array of substantially aligned boron nitride nano-elements deposited on a surface of the at least one of a heat-generating component and a heat sink, the array comprising: a plurality of substantially aligned carbon nano-elements; and a plurality of boron nitride nano-elements formed on, and extending from, ends of said plurality of substantially aligned carbon nano-elements, the boron nitride formed from a source of boron atoms and a source of nitrogen atoms, wherein the source of boron atoms comprises a boron containing compound selected from a group consisting of BH 3 , B 2 H 4 , and B 2 H 6 . 8. The electronic device of claim 7 further comprising: a layer of a first metal applied to a first end of the substantially aligned carbon nano-elements; and a layer of a second metal applied to a surface of the at least one of a heat-generating component and a heat sink. 9. The electronic device of claim 8 wherein the layer of the first metal and the layer of the second metal are pressed together at an elevated temperature such that the metal layers form at least one of a eutectic bond, a metal solid solution, and an alloy bond between the substantially aligned carbon nano-elements and the surface of the at least one of a heat-generating component and a heat sink. 10. The electronic device of claim 7 wherein the array extends from a substrate. 11. The electronic device of claim 7 wherein the substantially aligned carbon nano-elements are nanotubes. 12. The electronic device of claim 11 wherein a diameter of the nanotubes is from about 5 nm to about 20 nm. 13. The electronic device of claim 11 wherein a length of the nanotubes is from about 100 nm to about 100 μm. 14. The electronic device of claim 7 wherein the source of nitrogen atoms comprises a nitrogen containing compound selected from the group consisting of N 2 , NH 3 and N 2 H 4 . 15. The array of claim 1 , wherein said carbon nano-elements comprises carbon in an amount less than or equal to about 75 percent by weight of said carbon nano-elements.
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