Systems and methods for a heat sink

US10627093B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10627093-B2
Application numberUS-201715651941-A
CountryUS
Kind codeB2
Filing dateJul 17, 2017
Priority dateMay 3, 2017
Publication dateApr 21, 2020
Grant dateApr 21, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

First claim

Opening claim text (preview).

What is claimed is: 1. A linear heat sink for a light fixture formed from a unitary block of metal, the linear heat sink comprising: a rib formed by not fully extruding the unitary block of metal, the rib extending along a central longitudinal axis of the heat sink from a first end of the linear heat sink to a second end of the linear heat sink; first fins positioned on a first side of the rib, the first fins formed by extruding the unitary block of metal on the first side of the rib, the extruding extending from an upper surface of the unitary block of metal to a lower surface of the unitary block of metal; second fins positioned on a second side of the rib, the second fins formed by extruding the unitary block of metal on the second side of the rib, being formed by extruding the unitary block of metal from the upper surface of the unitary block of metal to the lower surface of the unitary block of metal on the second side of the rib; and a single, continuous base, wherein the base: has a central longitudinal axis that is directly aligned with the central longitudinal axis of the heat sink and a transverse axis that is transverse to the central longitudinal axis of the base; has a length extending along the central longitudinal axis of the base; has a transverse width extending along the transverse axis of the base which defines a flat portion of the base, wherein the length is greater than the transverse width; and comprises protrusions positioned on two opposite, distal ends of the base relative to the transverse axis, the protrusions extend at a downward angle from the flat portion of the base that partially expose lower surfaces of the first fins and the second fins is configured to cover portions of a lower surface of the linear heat sink such that each of the first fins and the second fins extend an equal distance beyond the flat portion of the base along the transverse axis of the base but do not extend beyond the protrusions of the base along the transverse axis of the base. 2. The linear heat sink of claim 1 , wherein the rib extends from the lower surface of the linear heat sink to an upper surface of the linear heat sink. 3. The linear heat sink of claim 1 , wherein the first fins and the second fins include grooves. 4. The linear heat sink of claim 1 , wherein the rib includes grooves. 5. The linear heat sink of claim 1 , wherein the base is configured to be directly coupled to multiple sections of the heat sink, each of the multiple sections including the rib, the first fins, and the second fins, wherein the base is a metal core printed circuit board base. 6. The linear heat sink of claim 1 , wherein the first fins and the second fins have three exposed edges, and a fourth edge being covered by the rib. 7. The linear heat sink of claim 1 , wherein upper surfaces of the first fins and the second fins are planar with an upper surface of the rib.

Assignees

Inventors

Classifications

  • Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

  • Forcing-frames; Lights {, i.e. glass panels covering the forcing-frames} · CPC title

  • the means being corrugated, plate-like elements · CPC title

  • Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

  • Lighting for industrial, commercial, recreational or military use · CPC title

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Frequently asked questions

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What does patent US10627093B2 cover?
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. …
Who is the assignee on this patent?
Fluence Bioengineering, Fluence Bioengineering Inc
What technology area does this patent fall under?
Primary CPC classification F21V29/502. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).