Liquid ejection head, liquid ejection apparatus, and electronic device

Patent metadata

Field	Value
Publication number	US-10625503-B2
Application number	US-201916287094-A
Country	US
Kind code	B2
Filing date	Feb 27, 2019
Priority date	Feb 28, 2018
Publication date	Apr 21, 2020
Grant date	Apr 21, 2020

Abstract

In a plan view from a perpendicular direction to a surface of a wiring substrate on which a wiring is provided, a buried wiring, a connection wiring, and a terminal portion of an external wiring are formed at an overlapping position, in which a recessed portion is provided at a position corresponding to the buried wiring on a surface of the connection wiring on an opposite side to the wiring substrate, and in which, in a direction intersecting an extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, a width of the connection wiring is larger than a width of the buried wiring, a width of the terminal portion of the external wiring is larger than a width of the recessed portion, and the terminal portion is provided across the recessed portion of the connection wiring.

First claim

What is claimed is:

1. A liquid ejection head comprising:
a channel formation substrate that is provided with a pressure generation chamber which communicates with a nozzle ejecting a liquid;
a drive element that is provided on the channel formation substrate and causes a pressure change in the pressure generation chamber; and
a wiring substrate that is provided with a wiring connected to a terminal portion of an external wiring,
wherein the wiring provided on the wiring substrate includes a buried wiring buried in a groove provided in the wiring substrate, and a connection wiring covering a surface of the buried wiring,
wherein, in a plan view from a perpendicular direction to a surface of the wiring substrate on which the wiring is provided, the buried wiring, the connection wiring, and the terminal portion of the external wiring are formed at an overlapping position,
wherein a recessed portion is provided at a position corresponding to the buried wiring on a surface of the connection wiring on an opposite side to the wiring substrate, and
wherein, in a direction intersecting an extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, a width of the connection wiring is larger than a width of the buried wiring, a width of the terminal portion of the external wiring is larger than a width of the recessed portion, and the terminal portion is provided across the recessed portion of the connection wiring.

2. The liquid ejection head according to claim 1 ,
wherein, in the direction intersecting the extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, the width of the terminal portion is larger than the width of the buried wiring.

3. A liquid ejection apparatus comprising the liquid ejection head according to claim 2 .

4. The liquid ejection head according to claim 1 ,
wherein the wiring having the buried wiring is a wiring for a drive signal.

5. A liquid ejection apparatus comprising the liquid ejection head according to claim 3 .

6. The liquid ejection head according to claim 1 ,
wherein the wiring having the buried wiring is a wiring for a power source and a ground.

7. A liquid ejection apparatus comprising the liquid ejection head according to claim 6 .

8. The liquid ejection head according to claim 1 ,
wherein the wiring substrate is provided with a drive circuit having a switching element for driving the drive element, and
wherein at least a part of the wiring connects the external wiring to the drive circuit.

9. The liquid ejection head according to claim 8 ,
wherein the drive circuit and the wiring substrate are electrically connected to each other via a bump provided in either one of the drive circuit and the wiring substrate.

10. A liquid ejection apparatus comprising the liquid ejection head according to claim 9 .

11. A liquid ejection apparatus comprising the liquid ejection head according to claim 8 .

12. The liquid ejection head according to claim 1 ,
wherein the wiring and the terminal portion are electrically connected to each other via a nonconductive adhesive which connects the wiring substrate and the external wiring to each other.

13. A liquid ejection apparatus comprising the liquid ejection head according to claim 12 .

14. The liquid ejection head according to claim 1 ,
wherein the wiring and the terminal portion are electrically connected to each other via an anisotropic conductive adhesive.

15. A liquid ejection apparatus comprising the liquid ejection head according to claim 14 .

16. The liquid ejection head according to claim 1 ,
wherein the wiring substrate is laminated on the channel formation substrate, and
wherein the wiring is provided on the wiring substrate on an opposite side to the channel formation substrate.

17. The liquid ejection head according to claim 16 ,
wherein a drive element connection wiring connected to the drive element is provided on an opposite surface of the wiring substrate to the surface on which the wiring is provided, and
wherein the drive element connection wiring and the drive element are electrically connected to each other via a bump provided on either one of the channel formation substrate and the wiring substrate.

18. The liquid ejection head according to claim 17 ,
wherein the bump includes an elastic core portion, and a metal film provided on a surface of the core portion.

19. A liquid ejection apparatus comprising the liquid ejection head according to claim 1 .

20. An electronic device comprising:
a wiring substrate that is provided with a wiring connected to a terminal portion of an external wiring,
wherein the wiring provided on the wiring substrate includes a buried wiring buried in a groove provided in the wiring substrate, and a connection wiring covering a surface of the buried wiring,
wherein, in a plan view from a perpendicular direction to a surface of the wiring substrate on which the wiring is provided, the buried wiring, the connection wiring, and the terminal portion of the external wiring are formed at an overlapping position,
wherein a recessed portion is provided at a position corresponding to the buried wiring on a surface of the connection wiring on an opposite side to the wiring substrate, and
wherein, in a direction intersecting an extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, a width of the connection wiring is larger than a width of the buried wiring, a width of the terminal portion of the external wiring is larger than a width of the recessed portion, and the terminal portion is provided across the recessed portion of the connection wiring.

Assignees

• Seiko Epson Corp

Inventors

• Tomimatsu Shingo
• Yamada Daisuke
• Hirai Eiju
• Takabe Motoki
• Watanabe Shunsuke

Classifications

• B41J2002/14491

  Electrical connection · CPC title

• B41J2202/18

  Electrical connection established using vias · CPC title

• B41J2202/11

  characterised by specific geometrical characteristics · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2/14233 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title