Adhesion to build plate in 3D printer

US10625337B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10625337-B2
Application numberUS-201815958576-A
CountryUS
Kind codeB2
Filing dateApr 20, 2018
Priority dateApr 21, 2017
Publication dateApr 21, 2020
Grant dateApr 21, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A 3D printer includes a build plate providing a surface on which an object is printed. Prior to printing, a sheet is fixed to the surface of the build plate. The sheet is composed of a material that adheres to a binder component of the feedstock used to print the object. During printing, the first layer of the printed object forms a bond with the sheet, which secures the location of the first layer and resists movement of the object during printing. Following printing and the object gaining sufficient rigidity, the object and sheet can be removed together from the printer. The sheet may then be peeled from the object, and the object can undergo debinding and/or sintering to create a finished object.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly comprising: a non-magnetic base sheet configured to be secured to a top surface of a build plate of a 3D printer; and an object, including a metal powder and a binder component, printed via the 3D printer, the object including: a first layer adhering to a top surface of the base sheet at at least one contact point, wherein the binder component of the object is a same as a component included in the base sheet, so that the first layer adheres to the base sheet via a bond between the component of the base sheet and the binder component of the object; and subsequent layers printed above the first layer, wherein the bond is releasable to enable the base sheet to be peeled from the first layer to separate the base sheet from the object. 2. The assembly of claim 1 , wherein the base sheet includes a material that forms a cross-linked bond with the binder component of the object at the at least one contact point. 3. The assembly of claim 1 , further comprising a debinder configured to remove at least some of the binder component from the object using a chemical solvent. 4. The assembly of claim 3 , wherein the base sheet includes a material that dissolves in response to exposure to the chemical solvent. 5. The assembly according to claim 1 , wherein the 3D printer includes a vacuum, and wherein the base sheet is configured to be secured to the top surface of the build plate of the 3D printer by a vacuum pressure. 6. The assembly according to claim 1 , wherein the base sheet includes at least one of polypropylene or polyethylene. 7. The assembly according to claim 1 , wherein the base sheet has a thickness of 0.1 mm to 3 mm. 8. The assembly according to claim 1 , wherein the bond between the base sheet and the binder component is an adhesion bond.

Assignees

Inventors

Classifications

  • Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface · CPC title

  • Processes of additive manufacturing · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Use of vacuum · CPC title

  • After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US10625337B2 cover?
A 3D printer includes a build plate providing a surface on which an object is printed. Prior to printing, a sheet is fixed to the surface of the build plate. The sheet is composed of a material that adheres to a binder component of the feedstock used to print the object. During printing, the first layer of the printed object forms a bond with the sheet, which secures the location of the first l…
Who is the assignee on this patent?
Desktop Metal Inc
What technology area does this patent fall under?
Primary CPC classification B22F3/1025. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).